Micron Breaks Ground on $9.3 Billion HBM Expansion in Hiroshima Factory

Micron has started construction on a ¥1.5 trillion ($9.3 billion) expansion at its semiconductor factory in Higashihiroshima City, Hiroshima Prefecture, Japan, to increase production of high-bandwidth memory (HBM) chips.

The project targets first shipments around summer 2028. The factory currently produces DRAM memory semiconductors. The expansion will focus on HBM, used in AI processors such as those from Nvidia.

Japan’s Ministry of Economy, Trade and Industry (METI) has allocated up to ¥536 billion ($3.3 billion) in subsidies, covering roughly one-third of the capital cost. Combined with other support, total government backing for the Hiroshima project reaches ¥774.5 billion, including ¥36 billion earmarked over five years for research and development. This marks Micron’s first major expansion at the site since 2019.

The Hiroshima facility was added to Micron’s operations in 2013 through the acquisition of the bankrupt Japanese DRAM maker Elpida Memory. According to Micron, the very first HBM production wafer was made at this site.

Construction will proceed in phases, with installation of semiconductor manufacturing equipment scheduled to begin in the second half of 2028.

At the groundbreaking ceremony on Saturday, Micron CEO Sanjay Mehrotra stated that the first HBM production wafer for the memory techno...