NVIDIA Pushes for 10 Gbps HBM4 Specs to Counter AMD’s MI450 Helios, SK hynix to Lead Supply in 2026

TrendForce reports that NVIDIA is urging suppliers of its Vera Rubin server racks to enhance HBM4 specifications, targeting a per-pin speed of 10 Gbps. This move comes as AMD prepares to launch its MI450 Helios platform in 2026. The feasibility of achieving these upgrades remains uncertain, but SK hynix is projected to maintain its position as the largest HBM4 supplier during the early mass-production phase.

HBM4, a critical component for AI servers, is being developed to improve transmission speeds and bandwidth, with the base die playing a key role in performance. Among major suppliers, Samsung has adopted a FinFET 4nm process for its HBM4 base die in 2024, aiming for volume production by year-end. Samsung’s 10 Gbps-capable products are expected to outpace those of SK hynix and Micron in production share.

NVIDIA’s primary concern is supply availability. If the proposed upgrades lead to insufficient volumes, higher power consumption, or excessive costs, NVIDIA may abandon the enhanced specifications or assign different component tiers to suppliers. Additionally, NVIDIA could extend second-phase certifications post-initial approval to allow vendors more time to adapt, potentially slowing the Vera Rubin platform’s production ramp-up.

For 2026, TrendForce forecasts that SK hynix will dominate HBM4 supply for NVIDIA, leveraging established...