OSAT
PM Modi Inaugurates CG Semi OSAT Facility in Sanand, Gujarat, Marking Third Semiconductor Plant Operational
Prime Minister Narendra Modi inaugurated the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat on July 4. This is the third semiconductor plant to commence operations in India, following the first on February 28 and the second on March 31.
4 min read
US-Made Direct-Drive V-783 Large-Aperture XY Motion Stage for Semiconductor Automation Offers 310 × 310 mm Travel and 1 nm Resolution
PI has introduced the V-783 high-precision linear motion stage. This U.S.-made direct-drive stage belongs to the V-700 series of mechanical-bearing XY stages. It offers 310 × 310 mm travel, nanometer-level resolution, and high-speed motion for precision scanning systems. The V-700 se
3 min read
Mitsui Signs Strategic Partnership Agreement with Kaynes Semicon and AOI Electronics for Semiconductor OSAT Operations in India
Mitsui has entered into a strategic business partnership agreement with Kaynes Semicon Private Limited and AOI Electronics. The agreement coincides with India's "Make in India" policy, which supports expansion of the manufacturing sector, including the allocation of substantial government subsidi
3 min read
Building an OSAT Business in the Semiconductor Packaging Market: Trends and Options for 2026
The semiconductor industry is undergoing a profound transformation, with packaging emerging as a critical differentiator in performance, power efficiency, and cost. As front-end fabrication approaches physical limits, Outsourced Semiconductor Assembly and Test (OSAT) providers a
10 min read
Tata Electronics and Bosch Partner for Semiconductor and Automotive Electronics Growth in India
Tata Electronics, a prominent Indian electronics and semiconductor manufacturer, and Robert Bosch GmbH, a global technology and services provider, have signed a Memorandum of Understanding (MoU) to collaborate in electronics and semiconductor manufacturing. The agreement, signed by Dr. Randhir Th
2 min read
Tachyum demonstrates enhanced reliability with DRAM failover on prodigy universal processor for large-scale AI and HPC applications
Tachyum announced a significant advancement in memory error correction technology with the successful demonstration of DRAM Failover on its Prodigy Universal Processor. This breakthrough enhances reliability for large-scale AI and high-performance computing (HPC) applications, even in the event
4 min read
Global semiconductor packaging material market to return to growth in 2024
Industry body SEMI estimates the global semiconductor packaging materials market powered by strong semiconductor demand across diverse end applications to start a growth cycle with a 5.6% compound annual growth rate (CAGR) through 2028. This study was done by SEMI in partnership with TECHCET and Te
2 min read
TI uses proprietary magnetic packaging tech for power modules to shrink them
Texas Instruments announced introduction of six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules, ena
3 min read
High-end packaging market to exceed US$28 billion by 2029
Yole reported the high-end packaging market is projected to exceed US$28 billion by 2029, with a CAGR 23-29 of 37%. TSMC and other top foundries, big IDMs like Intel and top memory providers YMTC, Samsung, SK Hynix, Micron and leading OSATs – ASE, SPIL, JCET, Amkor are all vying for a share of th
4 min read
nepes leverage Siemens EDA tools for its 3D-IC semiconductor packages
South Korea-based nepes corporation who is into Outsourced Semiconductor Assembly and Test (OSAT) services is employing Siemens EDA tools to address the intricate thermal, mechanical, and design complexities associated with developing advanced 3D-IC packages. nepes is dedicated to offering a comp
3 min read
India OSAT: Foxconn partner with HCL to setup semiconductor packaging unit in India
Taiwan's no. 1 electronics manufacturing expert Foxconn is partnering with India's leading electronics, computer and IT technology business conglomerate HCL group to set up a chip assembly, testing and packaging company in India. HCL is one of the earliest company in India to enter computer hardw
3 min read
Advanced semiconductor packaging to grow 10% to reach $78.6 B by 2028
With 3D semiconductor packaging becoming new Moore's Law extender, it is estimated to grow in 2023, even other semiconductor manufacturing market going weak in 2023. Yole notes: Advanced packaging (AP) revenue is expected to grow at a 10% CAGR, from US$44.3 billion in 2022 to US$78.6 billion by 20
2 min read
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