High-end packaging market to exceed US$28 billion by 2029

Yole reported the high-end packaging market is projected to exceed US$28 billion by 2029, with a CAGR 23-29 of 37%. TSMC and other top foundries, big IDMs like Intel and top memory providers YMTC, Samsung, SK Hynix, Micron and leading OSATs – ASE, SPIL, JCET, Amkor are all vying for a share of the high-end packaging market. The primary technological trend across all high-end performance packaging platforms, regardless of type, is the reduction of interconnection pitch. Breaking the high-end packaging market down by end markets, the largest segment is telecom & infrastructure, which accounted for over 67% of the revenue in 2023. Close behind is the mobile & consumer market, the fastest-growing segment with a 50% CAGR 23-29. This significant growth is driven by increasing demand and higher ASPs for high-end packages compared to less advanced packages, as value shifts from the front-end to the back-end due to 2.5D and 3D platforms. Stefan Chitoraga, Technology & Market Analyst, Semiconductor Packaging at Yole Group said "3D stack memory technologies—including HBM, 3DS, 3D NAND, and CBA DRAM—are the most substantial contributors, expected to represent more than 70% of the market by 2029. The fastest-growing platforms include CBA DRAM, 3D SoC, Active Si Interposer, 3D NAND stack, and embedded Si bridge." Vishal Saroha Technology & Market Analyst, Semiconductor Equipm...