nepes leverage Siemens EDA tools for its 3D-IC semiconductor packages

South Korea-based nepes corporation who is into Outsourced Semiconductor Assembly and Test (OSAT) services is employing Siemens EDA tools to address the intricate thermal, mechanical, and design complexities associated with developing advanced 3D-IC packages. nepes is dedicated to offering a comprehensive range of semiconductor packaging design and manufacturing services, emphasizing innovation and success in a highly competitive market landscape. By harnessing Siemens EDA's advanced technologies, nepes aims to achieve breakthroughs necessary for growth and differentiation in the industry. Nepes has integrated a suite of industry-leading solutions from Siemens EDA, including the Calibre nmPlatform featuring Calibre 3DSTACK software and HyperLynx software for electrical rule checking. Additionally, Siemens' Xpedition Substrate Integrator software and Xpedition Package Designer software complement nepes' capabilities, enabling fast and reliable design services, including 2.5D/3D-based chiplet designs. “nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” said Brad Seo, vice president of SAPEON Korea’s R&D center. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for ...