Component Engineering
AMD Releases Ryzen 9 9950X3D2 Dual Edition Processor with Dual AMD 3D V-Cache Technology
AMD released the Ryzen 9 9950X3D2 Dual Edition processor. It is the first desktop processor to feature dual AMD 3D V-Cache technology. The processor is built on “Zen 5” architecture with 16 cores, 32 threads, and 208MB of total cache. It has a boost frequency of up to 5.6 GHz, b
3 min read
JEDEC Advances DDR5 MRDIMM Standards with New Multiplexed Rank Logic and Gen2 Roadmap
JEDEC Solid State Technology Association announced milestones from its JC-40 and JC-45 Committees for Logic and DRAM Modules. The updates include the publication of a new DDR5 multiplexed rank data buffer (MDB) standard, progress on a multiplexed rank registering clock driver (MRCD) standar
2 min read
Murata Launches Set Proposal and Circuit Design Support for Automotive UWB Crystal Unit and Thermistor
Murata has announced a set proposal and circuit design support for a discrete configuration that combines the crystal unit ‘XRCGE55M200MZF1BR0’ and the thermistor ‘NCU03XH103F6SRL’ for automotive Ultra Wide Band (UWB) applications. The proposal targets automotive UW
3 min read
Arm Introduces Performix Performance Analysis Toolkit for AI Agent Workflows on Arm Platforms
Arm has announced Arm Performix, a free performance analysis toolkit for modern agentic development workflows. It is designed to provide scalable performance for AI agents by unifying performance insights and optimization across the Arm compute platform. Performix enables developers and AI a
5 min read
A Look at ST64UWB SoCs from STMicroelectronics featuring UWB Technology with 802.15.4ab Standard for Automotive and Consumer Applications
STMicroelectronics is offering range of ultra-wideband (UWB) system-on-chip solutions called the ST64UWB family that support the IEEE 802.15.4z standard and the upcoming IEEE 802.15.4ab specification, including multi-millisecond ranging (MMS) with narrow-band assistance radio (NBA). UWB te
4 min read
Global Electronics Association and Responsible Business Alliance Publish Joint Guidance on Scope 3 Category 1 GHG Emissions Accounting
The Global Electronics Association and Responsible Business Alliance today announced the publication of joint guidance on Accounting for Scope 3 Category 1 Greenhouse Gas Emissions. The guidance aims to provide the electronics industry with specific knowledge and practical recommendations to
3 min read
Valeo Launches High Voltage 2025 Project at Étaples Site for High-Voltage Inverter Production in France
Valeo has announced a new phase in the transformation of its Étaples site into a strategic hub for high-voltage electrification in France. With the "High Voltage 2025" industrial project, the Group is investing in the production of inverters, critical components of the electric powertrain.
5 min read
Intel and Google Expand Collaboration on Xeon Processors and Custom IPUs for AI Infrastructure
Intel Corporation and Google announced a multiyear collaboration to advance AI and cloud infrastructure, focusing on the role of CPUs and custom infrastructure processing units (IPUs) in heterogeneous AI systems. Under the agreement, Intel Xeon processors will continue to power Google Cloud
3 min read
JEDEC Announces May 2026 Forums on Next Generation Memory Standards for AI, Server, Cloud, and Mobile Computing
JEDEC Solid State Technology Association announced it will host two technical forums in San Jose, California, focused on emerging memory standards and system designs for AI, server, cloud, and mobile computing. The Mobile/Client/Edge Forum is scheduled for Tuesday, May 12, 2026, and the Server/Cl
2 min read
QuickLogic to Demonstrate RadPro FPGA Dev Kit at 41st HEART Conference
QuickLogic Corporation announced it will demonstrate its RadPro FPGA development kit in Booth 15 at the 41st Hardened Electronics and Radiation Technology (HEART) Conference, scheduled for April 13–17, 2026, in Shreveport, Louisiana. The RadPro Dev Kit enables Defense Industrial Base
2 min read
Global Electronics Association and MIMOS Berhad Sign MoU on Advanced Electronic Packaging for Malaysia Semiconductor Ecosystem
The Global Electronics Association and MIMOS Berhad signed a Memorandum of Understanding (MoU) to collaborate on strengthening Malaysia’s electronics and semiconductor ecosystem. The agreement focuses on advanced electronic packaging (AEP), industry alignment, and global best practices.
3 min read
Littelfuse Releases High-Reliability 15 kW and 30 kW SMT TVS Diodes for DO-160 Level 5 Lightning Protection
Littelfuse, announced the SM15KPA-HR/HRA and SM30KPA-HR/HRA High-Reliability Transient Voltage Suppressor (TVS) Diode Series. The new devices expand the company’s high-reliability TVS diode portfolio with compact SPD4-1 surface-mount packages designed for avionics, military, and other missi
3 min read
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