The Global Electronics Association and MIMOS Berhad signed a Memorandum of Understanding (MoU) to collaborate on strengthening Malaysia’s electronics and semiconductor ecosystem. The agreement focuses on advanced electronic packaging (AEP), industry alignment, and global best practices.
Malaysia has established strengths in assembly, testing, and semiconductor packaging, along with integration into global supply chains and the presence of multinational companies. The country is seeing momentum in AI, high-performance computing, communications, power, and automotive electronics. The industry is shifting toward heterogeneous integration of processors, memory, sensors, control, and power devices, increasing the need for ecosystem coordination and globally aligned frameworks to support scalability, interoperability, and competitiveness.
The MoU establishes a framework for collaboration in advancing AEP through:
- Advisory and insights on global market trends and strategic guidance
- Standards and best practices, including development of guidelines and standards
- Capability building via co-hosted workshops and knowledge-sharing initiatives
- Technical support for validation of design, assembly, and packaging technologies
- Ecosystem engagement with industry, academia, and government
The agreement builds on the Global Electronics Association’s presence in Malaysia.
Afdzal Syahadat Husin, Chief Executive Officer, MIMOS Technologies Sdn Bhd, stated that Malaysia’s electronics and semiconductor industry is entering a critical phase of transformation driven by the complexity of next-generation technologies and the shift toward advanced electronic packaging. The collaboration aims to strengthen Malaysia’s position in the global value chain through deeper industry alignment, accelerated capability development, and adoption of globally recognised standards and best practices. MIMOS intends to catalyse innovation, enhance ecosystem readiness, and support ambitions to become a leading hub for high-value electronics manufacturing in the region.
Matt Kelly, CTO and VP, Standards & Technology, Global Electronics Association, said advanced electronic packaging is becoming the backbone of next-generation technologies in AI, high-performance computing, automotive, power, and communications systems. Strengthening industry collaboration and developing globally aligned guidelines and standards is critical for Malaysia’s potential in this area.
Dr. Ranee Ramya, Country Manager Malaysia, Global Electronics Association, added that Malaysia’s electronics industry is focusing on advanced and high-value manufacturing segments. Strengthening industry alignment, advancing standards adoption, and enabling initiatives such as CQI programs and validation services are important for positioning Malaysia as a hub for advanced electronics in Southeast Asia.
