QuickLogic Corporation announced it will demonstrate its RadPro FPGA development kit in Booth 15 at the 41st Hardened Electronics and Radiation Technology (HEART) Conference, scheduled for April 13–17, 2026, in Shreveport, Louisiana.
The RadPro Dev Kit enables Defense Industrial Base (DIB) evaluation of QuickLogic’s first RadPro FPGA, which is fabricated in the U.S. on GlobalFoundries’ 12nm process technology. This process is commonly used by the DIB for radiation hardened ASICs. The FPGA was developed to meet operational requirements of various active programs in development with the DIB. The core RadPro FPGA technology is extensible to eFPGA Hard IP for radiation hardened ASIC and SoC designs.
The demonstration will include the Aurora FPGA User Tools for RTL-to-Bitstream development flow with integrated logic synthesis from Synopsys Synplify and yosys.
With this release, the first RadPro FPGA is now silicon-proven.
Brian Faith, CEO of QuickLogic, stated that the release demonstrates continued execution against the company’s radiation-hardened FPGA roadmap. The company accepted initial orders for the RadPro Dev Kit during Q1 and anticipates fulfilling them following the HEART Conference. With the RadPro FPGA now operational in hardware and supported by Aurora tools, it enables DIB evaluations that can transition into long-term defense and aerospace programs of record.
QuickLogic is accepting orders now for the RadPro FPGA Dev Kits, with shipments scheduled following the HEART Conference.
QuickLogic develops embedded FPGA (eFPGA) Hard IP, Radiation Hardened, Antifuse and ruggedized FPGAs.
