Component Engineering
Diodes Incorporated Launches I2C/SPI Programmable LED Drivers for Precise Automotive Lighting and Color Mixing
Diodes introduced the AL58818Q and AL58812Q, a series of automotive-compliant 18- and 12-channel linear LED drivers designed for precise color mixing and brightness control in automotive rear lamp modules, grille and emblem lights, interior ambient lighting, infotainment displays, status indicato
3 min readSEMI Addresses U.S. H-1B Visa Policy Changes Amid Semiconductor Talent Shortages
SEMI, the industry association serving the global electronics design and manufacturing supply chain, issued a statement from SEMI Americas President Joe Stockunas regarding the U.S. H-1B visa policy proclamation announced by President Trump on September 19, 2025. In the statement, Stockuna
2 min read
Global Electronics Association Rolls Out Flagship Events to Tackle AI, Supply Chain Resilience in $6 Trillion Sector
On September 22, 2025, the Global Electronics Association announced a lineup of conferences and tradeshows aimed at gathering leaders from the $6 trillion electronics industry to address emerging technologies, AI integration, supply chain durability, and related issues. The events are inte
4 min read
Newsletter from EEHerald for the 3rd week of Sept 2025
16 min read
e-con Systems Adds Camera Support for Renesas RZ/G3E to Enhance Edge AI Vision Applications
e-con Systems, a provider of embedded vision solutions, has announced camera support for Renesas’ RZ/G3E microprocessor, expanding its collaboration with Renesas to support applications in industrial automation, smart cities, and automotive sectors. This follows e-con Systems’ integra
2 min read
Infineon’s XHP 2 Power Modules Boost Energy Efficiency in Goldwind’s Grid-Forming Wind Turbines
Infineon Technologies AG and Goldwind Science & Technology have expanded their partnership to integrate Infineon’s XHP 2 1700 V IGBT5 power modules with .XT technology into Goldwind’s GW 155 - 4.5 MW grid-forming wind turbines. These modules aim to enhance energy efficiency, reduc
3 min readTexas Instruments Highlights Energy-Efficient Semiconductor Solutions for Automotive and Appliances at electronica India 2025
Texas Instruments (TI) presented its portfolio of analog and embedded processing semiconductors at electronica India 2025, held from September 17-19 at the Bangalore International Exhibition Centre. Located at Hall 3, booth D11, TI’s exhibit focuses on applications for energy infrastr
3 min readNVIDIA Pushes for 10 Gbps HBM4 Specs to Counter AMD’s MI450 Helios, SK hynix to Lead Supply in 2026
TrendForce reports that NVIDIA is urging suppliers of its Vera Rubin server racks to enhance HBM4 specifications, targeting a per-pin speed of 10 Gbps. This move comes as AMD prepares to launch its MI450 Helios platform in 2026. The feasibility of achieving these upgrades remains uncertain, but S
2 min readPanasonic Industry Launches Low-Profile POSCAP Capacitors for USB Type-C Power Delivery
Panasonic Industry announced the commercialization of two Conductive Polymer Tantalum Solid Capacitors (POSCAP), models 50TQT33M and 63TQT22M, designed for power circuits in information and communication equipment like laptops and tablets. These capacitors, with a 3 mm profile—the low
3 min read
Vishay Intertechnology to Highlight AI and EV Solutions at PCIM Asia 2025
Vishay Intertechnology will exhibit its latest semiconductor and passive component technologies at PCIM Asia 2025, held September 24-26 in Shanghai, China, at Booth N5, C48. The showcase will focus on solutions for AI infrastructure and electric vehicle (EV) applications, addressing server power
3 min readLantronix Introduces PoE++ Injector and Media Converters for Edge AI and IoT Applications
Lantronix announced the addition of three new Power-Over-Ethernet Plus-Plus (PoE++) devices to its portfolio: the SI-IES-5200-LRT unmanaged hardened PoE++ injector and the SI-IES-511D-LRT and SI-IES-521D-LRT unmanaged hardened PoE++ injector/converters. These multi-Gigabit devices support high-ba
2 min read
STMicroelectronics Outlines Automotive Industry Transformation at IAA Mobility 2025, Highlights E-Mobility and Software-Defined Vehicle Innovations
During a keynote at IAA Mobility 2025, Jean-Marc Chery, President and CEO of STMicroelectronics, discussed the automotive industry’s transformation, driven by e-mobility, software-defined vehicles, and a shifting global market landscape, particularly with China’s growing influence. ST
3 min read
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