Component Engg

Vishay Intertechnology to Highlight AI and EV Solutions at PCIM Asia 2025

Vishay Intertechnology will exhibit its latest semiconductor and passive component technologies at PCIM Asia 2025, held September 24-26 in Shanghai, China, at Booth N5, C48. The showcase will focus on solutions for AI infrastructure and electric vehicle (EV) applications, addressing server power supplies, DC/DC converters, power delivery units, battery backup units (BBUs), mainboards, optical modules, smart cockpits, vehicle computing, and advanced driver-assistance systems (ADAS).

For AI infrastructure, Vishay will display power MOSFETs in PowerPAK 8x8, 10x12, SO-8DC, 1212-F, and SO-8S packages with low on-resistance; microBUCK buck regulators supporting 4.5 V to 60 V input; 50 A VRPower integrated power stages in PowerPAK MLP55-31L; SiC diodes in TO-220, TO-247, D2PAK, SMA, and SlimSMA packages; TVS in DFN and SlimSMA packages; TMBS rectifiers with a 0.38 V forward voltage drop; IHLE series inductors with e-field shields for EMI reduction; low DCR and high voltage power inductors; T55 vPolyTan polymer tantalum chip capacitors with low ESR; thin film chip resistors with operating frequencies up to 70 GHz; Power Metal Strip resistors with low TCR, inductance, and thermal EMF; and PTC thermistors with energy absorption up to 340 J.

For automotive applications, Vishay will present reference designs, including active discharge circuits for 400 V and 800 V systems,...

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