News
IEEE ECTC 2026 Launches Student Innovation Challenge Focused on AI Datacenter Thermal Solutions and Electromigration in Semiconductor Packaging
The IEEE Electronic Components and Technology Conference (ECTC), the technical conference and product exhibition for the semiconductor packaging industry, has announced a Student Innovation Challenge for its 76th edition in 2026. Six winning student teams will attend ECTC 2026 with financial assi
3 min read
ROHM and Tata Electronics Announce Strategic Semiconductor Partnership
Japan based IDM semiconductor leader ROHM and Tata Electronics, an Indian electronics and semiconductor manufacturing company, have entered into a strategic partnership for semiconductor manufacturing in India targeting both Indian and global markets. The partnership combines ROHM’s
3 min read
Lattice Semiconductor Opens Second India R&D Center in Hyderabad in year 2025
Lattice Semiconductor has inaugurated its second research and development center in India, located in Hyderabad, extending its operations beyond Pune in the year of 2025. On December 19, 2025, Ashwani Bhat, Vice President Engineering and Managing Director India at Lattice Semiconductor, an
1 min read
Qualcomm Completes Alphawave Semi Acquisition for AI Data Center Connectivity Expansion
Qualcomm has completed its acquisition of Alphawave Semi, approximately one quarter ahead of schedule. The acquisition provides assets for Qualcomm's expansion into the data center market. Alphawave Semi's high-speed wired connectivity technologies complement Qualcomm's next-generation O
2 min read
HCLTech and Dolphin Semiconductor Partnership Targets Energy-Efficient Chips for AI Workloads, IoT, and Data Centers
HCLTech has announced a strategic partnership with Dolphin Semiconductor to co-develop energy-efficient chips. The collaboration aims to address demands for energy efficiency and performance in complex and connected environments. HCLTech will integrate Dolphin Semiconductor's low-power
2 min read
Kandou AI Announces Leadership Changes: New CEO, CTO, and COO to Drive AI Interconnect and CXL Solutions for Inference and Training Cost Reduction
Kandou AI, formerly known as Kandou, has appointed Srujan Linga as Chief Executive Officer (CEO), Taher Madraswala as Chief Operating Officer (COO), and transitioned founder Amin Shokrollahi from CEO to Chief Technology Officer (CTO). The company's vision focuses on using its interconnect
4 min read
Arteris Acquires Cycuity for Semiconductor Cybersecurity 2025
Arteris, announced a definitive agreement to acquire Cycuity, Inc., a provider of semiconductor cybersecurity assurance. The acquisition adds Cycuity’s technology to Arteris’ portfolio for data movement security in chiplets and SoCs. The acquisition addresses cyberattacks targe
2 min read
onsemi FORVIA HELLA Long-Term Agreement on T10 MOSFET Technology
onsemi announced the extension of its strategic engagement with FORVIA HELLA through a new long-term agreement for the adoption of onsemi’s PowerTrench T10 MOSFET technology in FORVIA HELLA’s advanced automotive platforms. The PowerTrench T10 MOSFET technology provides low cond
2 min read
AI and Consumer Electronics Drive Top-10 Foundry Revenue to $45.1 Billion in 3Q25
The global foundry industry recorded revenue growth in the third quarter of 2025, driven by demand for AI applications in high-performance computing (HPC), new consumer electronics chips, and IC peripherals. Advanced processes at 7nm and below contributed primarily, supported by high-value wafers
4 min read
Semiconductor Revenue Exceeds $200 Billion in Q3 2025 Amid AI and Memory Demand
Research from Omdia indicates that the semiconductor market reached $216.3 billion in revenue during the third quarter of 2025, a 14.5% increase quarter-over-quarter. This represents the first time quarterly revenue has surpassed $200 billion, following an 8% quarter-over-quarter growth in the se
2 min read
Qualcomm Acquires Ventana Micro Systems for RISC-V Expansion
Qualcomm announced the acquisition of Ventana Micro Systems Inc. The acquisition integrates Ventana’s expertise in RISC-V instruction set architecture development into Qualcomm’s CPU capabilities. The Ventana team will complement Qualcomm’s ongoing RISC-V and custom Oryon
1 min read
TOPPAN Installs Pilot Line for Advanced Semiconductor Packaging: Glass Interposers and Organic RDL for Post-5G and AI Applications
TOPPAN Inc. announced that it will install a pilot line for research and development of advanced semiconductor packaging at the Ishikawa Plant in Nomi, Ishikawa Prefecture, Japan. The plant was acquired in 2023. The pilot line is scheduled to be commissioned in July 2026. The development o
3 min read
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