TOPPAN Installs Pilot Line for Advanced Semiconductor Packaging: Glass Interposers and Organic RDL for Post-5G and AI Applications

TOPPAN Inc. announced that it will install a pilot line for research and development of advanced semiconductor packaging at the Ishikawa Plant in Nomi, Ishikawa Prefecture, Japan. The plant was acquired in 2023. The pilot line is scheduled to be commissioned in July 2026.

The development of organic redistribution layer (RDL) interposers on the pilot line has been selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of Manufacturing Technologies for Advanced Semiconductors, a subsidized project by the New Energy and Industrial Technology Development Organization (NEDO).

In advanced semiconductors for applications including generative AI and autonomous driving, packaging substrates are increasing in size and chiplet structures are being adopted for higher densities. Chiplet structures use intermediate substrates called interposers to connect chips to packaging substrates. Silicon interposers are currently predominant, but scaling challenges have led to exploration of interposer technology using large glass substrates as an alternative.

The pilot line will be used to verify technologies for future mass production through research and development of components for advanced semiconductor packaging, including interposers with large glass substrates, glass cores, and or...