News
onsemi Launches Elite Pairing Studio for SiC MOSFET and Gate Driver Combinations
onsemi has announced the Elite Pairing Studio, an online design tool for pairing silicon carbide (SiC) MOSFETs and gate drivers in power electronics applications. The tool targets AI data centers, electric vehicles, and industrial systems. It enables engineers to evaluate device-level behav
2 min read
MACOM Announces Hot Via Chip Scale Process on AlGaAs Technology
MACOM Technology Solutions has announced a chip scale hot via process built on its AlGaAs diode technology. The hot via process provides an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies. It simplifies surface mount assembly while d
2 min read
Tachyum Ports OpenJDK to Run Natively on Prodigy Universal Processor
Tachyum has successfully ported an OpenJDK build to run natively on the Prodigy Instruction Set Architecture (ISA). The porting of the Open Java Development Kit marks a milestone for the Prodigy Universal Processor. OpenJDK is the free, open-source reference implementation of the Java Platform, S
2 min read
VeriSilicon Adds AV2 Decoding Support to VC9800D Video Processing Unit IP
VeriSilicon has announced that its VC9800D Video Processing Unit (VPU) IP now supports AV2 decoding. The addition expands VeriSilicon’s video codec portfolio for next-generation video and streaming applications. The VC9800D enables configurable multi-format video processing for AI multimedi
2 min read
COSEIn 2026 Semiconductor Conference at IISc to Detail India's Semiconductor Ecosystem Progress on June 19
The Conference on Semiconductor Ecosystem in India (COSEIn) 2026, organized by the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc), is scheduled for June 19, 2026, at the A.V. Rama Rao Auditorium at CeNSE, IISc. Over the past few years, India&rsquo
4 min read
Efinix Announces Titanium Edge FPGA Family for Edge AI Applications
Efinix has announced the Titanium Edge family of FPGAs, designed for demanding edge AI deployments. The new family is built on the company’s Titanium architecture and targets high-growth markets requiring constrained power, si
5 min read
JEDEC Releases JEP203 and JEP204 Guidelines for Silicon Carbide Power Devices
JEDEC Solid State Technology Association announced the publication of two new documents developed by its JC-70.2 Silicon Carbide Subcommittee: JEP203 and JEP204. JEP203: Guideline for Short Circuit Evaluation in Power Conversion Transistors provides guidance for evaluating
2 min read
Insyde Software Provides UEFI BIOS Support for NVIDIA and Snapdragon X2 and C Platforms at COMPUTEX 2026
Insyde Software announced production-ready InsydeH2O UEFI BIOS support for multiple processor platforms used in Windows notebooks, including next-generation systems powered by NVIDIA processors, Snapdragon X2 Series, and Snapdragon C Platform. For notebooks built on NVIDIA processors
3 min read
Navitas Demonstrates 800V GaN Power Delivery Board for NVIDIA MGX AI Factory Platform at COMPUTEX 2026
Navitas Semiconductor participated in NVIDIA’s Partner Ceremony on May 29, 2026, at the Taipei Nangang Exhibition Center as part of the NVIDIA AI Factory MGX ecosystem. The company is showcasing its 800 V-to-6 V DC-DC power delivery board (PDB) at the NVIDIA AI Factory MGX Ecosystem Showcas
3 min read
Tachyum Reaffirms Prodigy Processor Development and Addresses BWB LLC Petition
Tachyum stated that it maintains operational strength, continues development of its Prodigy universal processor, and holds confidence in its legal position regarding a petition filed by BWB LLC and its manager. The company also responded to recent media reports concerning its facilities, financia
5 min read
Imec and EV Group Achieve Wafer-to-Wafer Hybrid Bonding at 200nm Interconnect Pitch with Sub-40nm Overlay Accuracy
Imec and EV Group (EVG) have demonstrated a wafer-to-wafer hybrid bonding technology with 200nm Cu interconnect pad pitch. The result was obtained on a test vehicle featuring four layers of routable interconnects pre-processed on each wafer prior to bonding. A post-bond Cu pad-to-pad overlay vect
4 min read
MediaTek and FOXTRON Partner on Dimensity AX C-X1 Platform with NVIDIA for AI Vehicle Systems
MediaTek announced a strategic, multi-year collaboration with FOXTRON Vehicle Technologies, a subsidiary of Hon Hai Technology Group (Foxconn), to integrate the MediaTek Dimensity AX C-X1 platform into premium automotive solutions. The platform incorporates NVIDIA’s GPU and advanced
3 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
▶ Podcast
