MACOM Technology Solutions has announced a chip scale hot via process built on its AlGaAs diode technology. The hot via process provides an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies. It simplifies surface mount assembly while delivering low insertion loss and high isolation.
Hot via technology routes RF signal and ground paths vertically through the die for direct surface mount attachment. By eliminating bond wires, it reduces assembly complexity, improves manufacturing consistency, minimizes parasitics, and supports high signal integrity and reliable performance into millimeter wave (mmWave) frequencies.
The new process will be deployed on MACOM’s AlGaAs diode technology for applications including switches, limiters, and other control functions.
The first product using the AlGaAs hot via process is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz. It features typical insertion loss of 0.9 dB, 30 dB isolation, and sub-20 ns switching speeds in a compact 1.87 mm x 1.98 mm chip scale package.
Stephen G. Daly, President and Chief Executive Officer of MACOM, stated that the hot via-based AlGaAs process can reduce assembly complexity while improving the high frequency performance of integrated components.
The MASW-011261 and MACOM’s hot via process technology is displayed at MACOM’s Booth #17035 at the International Microwave Symposium (IMS 2026) from June 9 to 11, 2026 in Boston, MA.
