Advanced Semiconductor
Sub-2nm Semiconductor Manufacturing: Emerging Technologies for Sustainable, Cost-Effective Chip Production
Well, Many have concluded Moore's law has hit a wall a decade age, that's true to some extent but only in terms of the using Lithography tech used for decades from 1970s to 2020s. The totally new way of making nano devices are emerging using highly innovation techniques taking the integration and
8 min read
Atomic Layer Etching Breakthrough: APS Technology Targets 14 Ångstrom Semiconductor Nodes Without EUV
The semiconductor industry, driven by the demand for smaller, more efficient chips, has relied on extreme ultraviolet (EUV) lithography to scale down to 2-nanometer processes. However, the high cost and complexity of EUV equipment, costing hundreds of millions, have limited its profitability for
5 min read
Smartkem and Manz Asia Announce Preliminary Joint Development Agreement for AI Chip Packaging Dielectric Ink Solutions
Smartkem, a company focused on transistor technology, has entered into a preliminary, non-binding Joint Development Agreement (JDA) with Manz Asia, a developer of advanced packaging equipment for the semiconductor industry. The agreement, when finalized, will center on co-developing dielectric in
2 min read
Nano-ribbon/sheet Transistors in 2nm: Intel's Patent US20250212463A on Metal-All-Around Contact Structure for dense VLSI Semiconductor Chips
Interesting patent on fabricating 2nm and lower node semiconductor chips: The U.S. Patent Application Publication 20250212463, filed by Intel Corporation on December 20, 2023, and published on June 26, 2025, introduces a novel fabrication method and integrated circuit (IC) structure featuring a m
3 min read
Sustainable Semiconductor Manufacturing Through Wafer Reuse
The semiconductor industry, vital to modern technology, consumes vast resources, using approximately 13,000 million square inches of silicon wafers annually to produce billions of chips. The chart below llustrates shipment growth from 2020 to 2024 reflects this escalating demand. Although silicon
6 min read
ELENA Project Advances Photonic Integrated Circuits with Europe’s First LNOI Platform
The 42-month EU-funded ELENA project has concluded with the development of Europe’s first lithium niobate on insulator (LNOI) substrates for photonic integrated circuits (PICs), creating a fully European supply chain for thin-film lithium niobate (TFLN) technology. The €5 million initi
3 min read
New 3D fabrication process integrates Gallium Nitride transistors onto silicon chips
Researchers from MIT and other institutions have developed a new method to integrate high-performance gallium nitride (GaN) transistors onto standard silicon CMOS chips. The process is low-cost, scalable, and compatible with existing semiconductor foundries, addressing the high cost and specializ
4 min read
University of Michigan study reveals safer method for synthesizing 2D Molybdenum Disulfide
A research team at the University of Michigan has published a study in the Chemistry of Materials Journal demonstrating a new method for synthesizing high-quality two-dimensional (2D) molybdenum disulfide (MoS2) using Veeco Instruments Inc.’s Fiji G2 plasma-enhanced atomic layer deposition
2 min read
Imec and Tokyo Electron extend partnership for beyond-2nm semiconductor development
Imec, a research hub in nanoelectronics and digital technologies, has extended its strategic partnership with Tokyo Electron (TEL), a Japanese supplier of semiconductor production equipment, for an additional five years. The agreement aims to advance joint research and development in next-generat
3 min read
Strategic materials conference 2025 to address semiconductor manufacturing innovations
The Strategic Materials Conference (SMC) 2025, scheduled for June 23-25 at Hayes Mansion in San Jose, California, will focus on materials innovation for semiconductor manufacturing. The event will bring together executives and technology leaders to discuss trends and advancements in the field. Re
2 min read
IEEE ISCAS 2025 concludes in London with focus on cutting edge circuits and system innovations such as neural architecture
The IEEE International Symposium on Circuits and Systems (ISCAS) 2025, held from May 25 to May 28 in London, concluded successfully. As the flagship conference of the IEEE Circuits and Systems (CAS) Society, it served as a global forum for researchers in the theory, design, and implementation of
4 min read
3D semiconductor: Advancing SRAM scaling with 3D integration of 2D MoS₂ FETs
Static Random-Access Memory (SRAM) is a cornerstone of modern computing, critical for cache memory, buffers, and registers due to its high-speed performance and low power consumption. However, scaling SRAM to advanced semiconductor technology nodes faces significant hurdles, wit
10 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
▶ Podcast