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Today's newsletter dated 6th May 2025

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Synaptics and Murata collaborate on advanced wi-fi and bluetooth modules for automotive applications

Synaptics and Murata collaborate on advanced wi-fi and bluetooth modules for automotive applications Image

Synaptics and Murata announced a strategic partnership to develop a next-generation turnkey wireless connectivity module for automotive Tier 1 suppliers and OEMs. This collaboration leverages Synaptics’ Veros Wi-Fi and Bluetooth combo systems on chips and Murata’s expertise in RF and

Read more: https://www.eeherald.com/section/news/p20250506nwsynaptics.html

Intel core ultra series 2 processors achieve full NPU support in MLPerf client v0.6 benchmark, leading AI compute performance

Intel core ultra series 2 processors achieve full NPU support in MLPerf client v0.6 benchmark, leading AI compute performance Image

Intel announced an achievement in AI compute performance with its Intel Core Ultra Series 2 processors, becoming the first and only company to achieve full neural processing unit support in the newly released MLPerf Client v0.6 benchmark. This milestone marks the industry's first standardized eva

Read more: https://www.eeherald.com/section/news/p20250506nwintel01.html

IPC-8981: establishing global standards for quality and reliability in E-Textile wearables

IPC-8981: establishing global standards for quality and reliability in E-Textile wearables Image

IPC announced the release of IPC-8981, a standard that establishes the first global benchmarks for the quality and reliability of e-textile wearables. This pioneering standard addresses critical challenges in product reliability, performance, and quality assurance, providing a common framew

Read more: https://www.eeherald.com/section/news/p20250506nwipc01.html

Siemens and Intel foundry collaborate on advanced IC and packaging solutions for 2D and 3D integration

Siemens and Intel foundry collaborate on advanced IC and packaging solutions for 2D and 3D integration Image

Siemens announced significant advancements in its ongoing collaboration with Intel Foundry. This partnership has resulted in multiple product certifications, updated foundry reference flows, and enhanced technology enablement leveraging Intel Foundry’s leading-edge technologies for next-gen

Read more: https://www.eeherald.com/section/news/p20250506nwsiemens.html

Indian PCB market and technology trends, opportunities and vendor analysis

Indian PCB market and technology trends, opportunities and vendor analysis Image

The design of printed circuit boards (PCBs) has evolved into a specialized area within the electronics sector. PCBs are crucial as they provide electrical connections between electronic components, offer rigid support to hold these components, and create a compact package that c

Read more: https://www.eeherald.com/section/news/p20250506nw01pcb.html

India's import of semiconductor devices from China in 2024

India's import of semiconductor devices from China in 2024 Image

India's Imports from China was US$126.96 Billion during 2024, according to the United Nations COMTRADE database on international trade. electrical and electronics goods were some of the major among imports.

Read more: https://www.eeherald.com/section/news/p20240405nwinchina.html

IISc Researchers harness hidden power of defects: Impact ionization in 2D transition metal dichalcogenide FETs

IISc Researchers harness hidden power of defects: Impact ionization in 2D transition metal dichalcogenide FETs Image

The development of high-performance, reliable, and robust electronic devices necessitates a fundamental understanding of hot carrier dynamics, high field transport, and electrical breakdown mechanisms in transition metal dichalcogenide field-effect transistors. In an article pub

Read more: https://www.eeherald.com/section/news/p20250505nw00fet.html

Advancing AI with quantum computing: IonQ's hybrid quantum-classical techniques for LLM fine-tuning and materials science

Advancing AI with quantum computing: IonQ's hybrid quantum-classical techniques for LLM fine-tuning and materials science Image

IonQ announced advancements in applying quantum computing to AI and machine learning. These developments mark significant progress in hybrid quantum-classical approaches that enhance both LLMs and generative AI. In a newly published paper, IonQ introduced a hybrid quantum-classical a

Read more: https://www.eeherald.com/section/news/p20250502nwionq.html

Palladyne AI and Red Cat achieve milestone with autonomous multi-drone collaboration

Palladyne AI and Red Cat achieve milestone with autonomous multi-drone collaboration Image

Palladyne AI and Red Cat Holdings announced a significant testing milestone in their ongoing collaboration—the successful completion of an autonomous, cross-platform collaborative flight involving three diverse heterogeneous drones. During this recent testing phase, which utilized Re

Read more: https://www.eeherald.com/section/news/p20250502nwpaaldyne.html

Semtech's ERA chip introduces hearing aids with ultra-low power 2.4GHz wireless radio and advanced power management

Semtech's ERA chip introduces hearing aids with ultra-low power 2.4GHz wireless radio and advanced power management Image

Semtech announced a significant advancement in hearing aid technology through its collaboration with Sonova AG. The partnership has resulted in the development of the ERA chip, an ultra-small, ultra-low power 2.4GHz wireless radio and power management IC that significantly enhances Bluetooth conn

Read more: https://www.eeherald.com/section/new-products/p20250506npsemtech.html

SiTime's Symphonic SiT30100 enhances mobile connectivity with superior thermal resilience and integrated MEMS resonator

SiTime's Symphonic SiT30100 enhances mobile connectivity with superior thermal resilience and integrated MEMS resonator Image

SiTime announced the launch of Symphonic, its first mobile clock generator with an integrated MEMS resonator, the SiT30100. This innovative product provides accurate and resilient clock signals for 5G and GNSS chipsets, enabling efficient power consumption in mobile and IoT devices such as smartp

Read more: https://www.eeherald.com/section/new-products/p20250506npsitime.html

Navitas introduces industry-first AEC-Plus qualified SiC MOSFETs in HV-T2PaK package for enhanced automotive and industrial reliability

Navitas introduces industry-first AEC-Plus qualified SiC MOSFETs in HV-T2PaK package for enhanced automotive and industrial reliability Image

Navitas announces the launch of its groundbreaking 650 V and 1200 V trench-assisted planar SiC MOSFETs. These innovative devices, housed in the HV-T2PaK top-side cooled package, set a new industry benchmark for reliability and performance in automotive and industrial applications.

Read more: https://www.eeherald.com/section/new-products/p20250506npnavitas.html

Alpha and Omega semiconductor launches Gen3 1200V αSiC MOSFETs to boost efficiency in high-power applications

Alpha and Omega semiconductor launches Gen3 1200V αSiC MOSFETs to boost efficiency in high-power applications Image

AOS announced the launch of its next-generation (Gen3) 1200V αSiC MOSFETs. These advanced MOSFETs are engineered to enhance efficiency in a growing market of high power applications, offering up to 30 percent improved switching figure-of-merit compared to AOS’ previous generation, whi

Read more: https://www.eeherald.com/section/new-products/p20250502npaos23.html

NoMIS power achieves 20% reduction in on-resistance with next-gen 1.2 kV SiC planar MOSFETs

NoMIS power achieves 20% reduction in on-resistance with next-gen 1.2 kV SiC planar MOSFETs Image

NoMIS Power has announced a significant breakthrough in its next-generation 1.2 kV planar SiC MOSFET platform. The new devices achieve substantial reductions in on-resistance by optimizing device design and process steps, making it easier than ever to integrate SiC into legacy systems or push the

Read more: https://www.eeherald.com/section/new-products/p20250502npsicmosfet.html

Ultra-low current power management ICs for efficient energy harvesting in rechargeable battery systems

Ultra-low current power management ICs for efficient energy harvesting in rechargeable battery systems Image

Asahi Kasei Microdevices announced the development of the AP4413 series, a new line of ultra-low current power management ICs designed for battery charging systems in energy harvesting applications. The AP4413 series, which has been in mass production since February 2025, is ideal for use i

Read more: https://www.eeherald.com/section/new-products/p20250501npakm021.html

Bourns introduces enhanced shielded power inductor series with improved electrical characteristics

Bourns introduces enhanced shielded power inductor series with improved electrical characteristics Image

Bourns is excited to announce the addition of four new product series to its renowned line of shielded power inductors. The new Bourns SRP4021HMCT, SRP4021HMT, SRP5030HMCT, and SRP5030HMT Shielded Power Inductor Series are designed to deliver enhanced power handling, increased efficiency, and opt

Read more: https://www.eeherald.com/section/new-products/p20250501nwbourns01.html

Pickering interfaces introduces high-speed PXI resolver simulation modules for enhanced servo system testing in aerospace and automotive applications

Pickering interfaces introduces high-speed PXI resolver simulation modules for enhanced servo system testing in aerospace and automotive applications Image

Pickering Interfaces has announced the expansion of its 41-670 (PXI) and 43-670 (PXIe) LVDT, RVDT, and resolver simulator modules. The new modules achieve rotation speeds of up to 130kRPM, addressing the growing need for precise and reliable testing of advanced servo systems in critical industrie

Read more: https://www.eeherald.com/section/new-products/p20250501nwpickering01.html

AOS introduces mega IPM-7 series: high-efficiency, compact power Modules for BLDC motor drives

AOS introduces mega IPM-7 series: high-efficiency, compact power Modules for BLDC motor drives Image

AOS, announced the launch of its Mega IPM-7 series intelligent power modules. These new modules are designed to offer high efficiency, compactness, and durability, making them ideal for brushless DC motor drive applications, including home appliances such as air-conditioners, refrigerators,

Read more: https://www.eeherald.com/section/new-products/p20250430np001aos.html

VeriSilicon launches ISO 26262 certified automotive-grade SoC platform with advanced multi-core architecture and ASIL D-level safety for intelligent driving applications

VeriSilicon launches ISO 26262 certified automotive-grade SoC platform with advanced multi-core architecture and ASIL D-level safety for intelligent driving applications Image

VeriSilicon announces the launch of its automotive-grade high-performance intelligent driving system-on-chip design platform. This innovative platform has been verified and successfully implemented in customer projects, leveraging VeriSilicon’s Silicon Platform as a Service business model t

Read more: https://www.eeherald.com/section/new-products/p20250429np001veri.html


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