Infineon Technologies AG and Marelli have collaborated to develop a MEMS laser beam scanning (LBS) system for a
The enduring power of 28nm: Unlocking market potential through foundry franchising
In spite of developing advanced Angstrom node chip manufacturing, chips made in 28 nm mature node generating significant revenues in many applications. This article provides detailed analysis exploring the market opportunities, chall
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Geopolitics of data: How India’s digital independence fuels its semiconductor ambitions
The storage and handling of user data across borders by companies, such as U.S. firms storing Chinese user data or Chinese firms storing U.S. user data, is a significant factor in current geopolitical tensions and the push for tech sovereignty.
Development of a European-based 650V GaN power device platform through IQE and X-FAB collaboration
IQE and X-FAB Silicon Foundries SE, are pleased to announce a Joint Development Agreement to create a European-based GaN Power device platform solution.With an initial two-year scope of work, IQE and X-FAB will collaborate to develop a 650V GaN device. The agreement will leverage IQE’s
Nexalus and Intel launch 95% heat capturing liquid cooling solutions for edge computing
Nexalus and Intel have partnered to develop thermal management solutions for high-performance edge computing an
India's smartphone market began 2025 on a cautious note, with Q1 shipments falling 8% year-on-year to 32.4 million units, according to the latest report from Canalys (now part of Omdia). The decline is attributed to persistent demand weakness and elevated channel inventory from late 2024, which
Molybdenum role in 2D and 2nm GAA semiconductor chip fabrication rising the demand for this metal
Copper dominated as metal interconnect in chips for decades, however now at 2nm with vertically forming gate all around (GAA) transistors and future Complementary-Field Effect Transistor (CFET), Copper is creating problems such as high diffusivity, voids in filling, and Edge-Placement Errors (EPE
RoboSense announces the launch of EMX, its latest 192-beam high-performance automotive digital LiDAR. EMX sets a new industry benchmark, accelerating the mass adoption of digital LiDAR with unmatched performance, integration, and customization capabilities.
Toshiba introduces 24TB N300 and N300 Pro HDDs for enhanced NAS and private cloud storage
Toshiba announced the expansion of its N300 and N300 Pro Series of internal hard disk drives with the introduction of new 24TB models. These new additions offer 2TB more capacity than the current 22TB versions, making them ideal for enhancing the storage capacity of network attached storage and p
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High-performance bluetooth 5.4 LE audio module from Panasonic with dual cortex-M33 processors
Panasonic announced the launch of its latest innovation in wireless communication technology, the PAN1783/1783A Series Bluetooth 5.4 LE Audio Wireless Modules. These cutting-edge modules, based on the Nordic nRF5340 single-chip controller, are designed to deliver exceptional performance, versatil
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