Component Engineering
onsemi Supplies Hybrid Power Integrated Modules with FS7 IGBT and EliteSiC to Sineng Electric for 430 kW Energy Storage Systems and 320 kW Solar Inverters
onsemi announced a design win with Sineng Electric. The company’s latest-generation hybrid power integrated modules (PIMs) will be used in Sineng’s next-generation 430 kW liquid-cooled energy storage systems (ESS) and 320 kW utility-scale solar string inverter. The hybrid PIM f
2 min read
pSemi introduces New Power Solutions for Mobile Fast-Charging and Humanoid Robotics at APEC 2026
pSemi, a Murata Company, announced two new power products at APEC 2026 in San Antonio: the PE26100 multi-level buck converter and the PE25304 advanced integrated charge pump switching-capacitor power module. The PE26100 is a multi-level buck converter optimized for main direct battery char
3 min read
Renesas Launches GaN-Based HWLLC Converter for 500W Charging in Industrial and IoT Applications
Renesas the expansion of its AC/DC and power adapter solutions with a new GaN-based Half-Wave LLC (HWLLC) platform. The platform supports 500W or higher operation across IoT, industrial, and infrastructure systems. The HWLLC converter topology scales from 100W-class designs to 500W, enabling high
3 min read
Diodes Incorporated Launches 100V PowerDI8080-5 MOSFET with Low RDS(ON) for 48V Automotive Systems
Diodes Incorporated introduced a new 100V N-channel MOSFET in its PowerDI8080-5 automotive-compliant portfolio on March 25, 2026. The DMTH10H1M7SPGWQ features a maximum RDS(ON) of 1.5mΩ and is designed for 48V systems in battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), and
2 min read
MACOM Introduces 448G PAM4 Modulator Drivers MAOM-025408 and MAOM-022404 for 3.2T Optical Transceivers
MACOM Technology Solutions announced the availability of two new 448G PAM4 modulator drivers, the MAOM-025408 Mach-Zehnder Driver and the MAOM-022404 EML Driver, designed to support next-generation 1.6T and 3.2T optical transceivers. The drivers enable 400G per lane transmission, facilitating den
2 min read
MediaTek and Microsoft Research Develop Active MicroLED Cable for Data Center Optical Interconnects
MediaTek, Microsoft Research, and collaborating suppliers have designed a next-generation Active Optical Cable (AOC) that uses miniaturized MicroLED light sources. The Active MicroLED Cable addresses trade-offs in current data center network transmissions involving reach, power consumption,
3 min read
AMD and Celestica Partner on Helios Rack-Scale AI Platform Featuring Instinct MI450 Series GPUs
AMD and Celestica announced a strategic collaboration to bring the open standards-based “Helios” rack-scale AI platform to market. The collaboration combines AMD's capabilities in high-performance and AI computing with Celestica’s expertise in advanced networking switch te
3 min read
Cadence Appoints Dr. Alok Jain as Managing Director for India to Lead Semiconductor Growth
Cadence Design Systems announced the appointment of Dr. Alok Jain as Managing Director for the India region. In this position, Dr. Jain will lead Cadence's strategic efforts in India, with a focus on scaling operations, advancing innovation, and expanding collaborations with the Indian government
3 min read
MaxLinear to Demonstrate 1.6T Rushmore DSP and Washington TIA at OFC 2026 for AI Data Center Connectivity
MaxLinear, announced it will exhibit its next-generation 1.6T PHY chipset at OFC 2026, taking place March 17–19 in San Diego. The showcase will occur at South Hall, Booth 1049, and will feature live demonstrations of the Rushmore 200G/lane PAM-4 DSP family and the Washington 200G/lane TIA.<
3 min read
Intel Xeon 6 Selected as Host CPU for NVIDIA DGX Rubin NVL8 AI Systems
At NVIDIA GTC 2026, Intel announced that its Intel Xeon 6 processors are being used as the host CPUs in NVIDIA DGX Rubin NVL8 systems. The selection positions Xeon 6 as a key component for orchestrating, scaling, and securing GPU-accelerated AI infrastructure during the transition to large-scale,
4 min read
Qualcomm and Wayve Collaborate on Pre-Integrated End-to-End AI for ADAS and Automated Driving Using Snapdragon Ride
Qualcomm Technologies, and Wayve announced a technical collaboration to deliver a production-ready advanced driver assistance and automated driving (ADAS/AD) system for automakers worldwide. The partnership integrates Wayve AI Driver as an end-to-end AI driving intelligence layer with Qualcomm&rs
3 min read
Synopsys Highlights NVIDIA Partnership Advances at GTC 2026 with Customer Accelerations in AI-Enabled Engineering
Synopsys, is presenting the outcomes of its strategic partnership with NVIDIA at NVIDIA GTC 2026, focusing on integrations of NVIDIA AI and accelerated computing with Synopsys engineering solutions for design, simulation, and verification across semiconductor, aerospace, automotive, and industria
4 min read
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