MediaTek, Microsoft Research, and collaborating suppliers have designed a next-generation Active Optical Cable (AOC) that uses miniaturized MicroLED light sources. The Active MicroLED Cable addresses trade-offs in current data center network transmissions involving reach, power consumption, and reliability. Existing electrical copper links provide energy efficiency and high reliability but are restricted to distances under 2 meters. Traditional laser-based optical links extend farther but consume more power and exhibit failure rates up to 100 times higher than copper.
The design replaces conventional “Narrow-and-Fast” (NaF) laser channels with hundreds of parallel “wide-and-slow” low-speed MicroLED channels, leveraging Microsoft Research’s MOSAIC technology and MediaTek’s engineering.
Key technical achievements in the fully integrated end-to-end design include:
Power consumption reduction of up to 50% compared to conventional VCSEL-based AOCs, achieved by using directly modulated MicroLEDs and eliminating complex Digital Signal Processing (DSP).
Reliability matching copper levels, due to the simple structure, high endurance, and temperature insensitivity of MicroLEDs, surpassing current laser-based optics.
Extended reach with copper-equivalent reliability, suitable for large-scale cross-rack connections in AI training clusters.
Scalability through increasing the number of optical lanes in a single cable or raising per-channel data rates.
Monolithic CMOS integration on a single custom chip that combines SoC logic, gear box, high-density MicroLED drivers, and high-sensitivity Transimpedance Amplifiers (TIAs), removing power and latency penalties from multi-chip interconnects.
Heterogeneous integration where the MicroLED array and Photodetector (PD) array are directly bonded onto the monolithic CMOS chip, eliminating wire-bonding and long interconnect routings for smaller pixel pitch and denser channel arrays.
The design supports scaling to 800 Gbps and beyond within standard QSFP/OSFP form factors and remains compatible with existing data center equipment for potential seamless transition.
Vince Hu, Corporate Vice President at MediaTek, stated that the collaboration combines expertise to address industry bottlenecks by miniaturizing MicroLED technology and integrating it into transceivers.
Doug Burger, Technical Fellow and Corporate Vice President at Microsoft Research, noted that the partnership advances efficiency, reliability, and cost in AI data center systems while enabling more powerful AI scenarios.
The parties continue to explore miniaturization and mass production readiness to support future gigawatt-scale AI data centers.
