Component Engineering
Intel and NVIDIA Announce AI and PC Collaboration with NVLink Integration and $5B Stock Investment
Intel and NVIDIA have entered into a collaboration to develop multiple generations of custom data center and personal computing products, focusing on AI infrastructure and consumer markets. The partnership integrates NVIDIA’s AI and accelerated computing technologies with Intel’
1 min readSemiconductor Talent Gap in Focus at “Accelerating Europe’s Tech Advantage” Forum in Brussels on Oct.2
SEMI Europe, alongside the European Chips Diversity Alliance (ECDA), European Chips Skills Academy (ECSA), OECD, and EU STEM Coalition, announced the “Accelerating Europe’s Tech Advantage” forum, scheduled for October 2, 2025, in Brussels. The event will bring together policymak
3 min readLam Research and JSR/Inpria Collaborate on EUV Lithography and Patterning for Advanced AI Chips
Lam Research and JSR Corporation, the parent company of Inpria Corporation, have entered into a non-exclusive cross-licensing and collaboration agreement to advance semiconductor manufacturing. The partnership focuses on next-generation patterning, specifically dry resist technology for extreme u
2 min read
India’s PC Market to Hit 15.1 Million Units in 2025, Driven by AI and Education Demand
India’s PC market, excluding tablets, grew 6% year-on-year in Q2 2025, reaching 3.6 million units, according to Canalys (part of Omdia). Notebook shipments increased 8% to 2.7 million units, fueled by enterprise demand and AI-ready devices, while desktop shipments rose 1% to 861,000 units.
4 min readDigi International’s Connect Sensor XRT-M Earns 2025 IoT Evolution Award for Rugged Edge AI Monitoring
Digi International announced that its Digi Connect Sensor XRT-M has been awarded the 2025 IoT Evolution Product of the Year by IoT Evolution World. The solution, paired with Digi Axess, is designed for remote monitoring in industrial IoT applications, supporting oil and gas, utilities, water, agr
2 min readAI Surge and Server Expansion Fuel 12.7% Enterprise SSD Revenue Growth in 2Q25
TrendForce reported that enterprise SSD revenue for the top five brands reached over US$5.1 billion in 2Q25, reflecting a 12.7% quarter-on-quarter increase. The growth was driven by heightened demand from NVIDIA’s Blackwell platform shipments and expanded general server deployments by North
3 min readMainland China PC Shipments Surge 12% in Q2 2025, Tablet Market Grows 18% Amid AI Push, Canalys Reports
Mainland China’s PC market (excluding tablets) grew 12% year-on-year in Q2 2025, reaching 10.2 million units, according to Canalys, part of Omdia. Consumer and commercial PC shipments rose 13% and 12%, respectively, driven by consumer subsidies and procurement from state-owned enterprises (
3 min readSEMICON Taiwan 2025 Sees Record Global Participation Amid AI Chip Boom
SEMICON Taiwan 2025, set to begin with forums on September 8 and exhibitions from September 10-12 at Taipei Nangang Exhibition Center, has reached a record high in pre-registration, according to SEMI. The event, marking its 30th anniversary, will host over 1,200 companies, 4,100 booths, and parti
2 min readTachyum Showcases AI-Optimized Flash Storage Solutions at China International Fair for Investment & Trade 2025
Tachyum will participate in the 25th China International Fair for Investment & Trade (CIFIT), held from September 8-11, 2025, at the Xiamen International Conference & Exhibition Center, as part of the Slovak national group organized with the Slovak Investment and Trade Development Agency
2 min read6G Integrated Sensing and Communications Poised to Reshape Mobile Networks
Integrated Sensing and Communications (ISAC), a core concept for 6G, enables cellular networks to function as radars, sensing their environment while transmitting data, according to ABI Research’s *Integrated Sensing and Communications: Market Developments & Use Case Analysis* report. T
2 min readiPhone 17 Series Set for 2025 Launch with "Air" Model and Enhanced Features, TrendForce Reports
Apple will introduce four new flagship devices in 2025: the iPhone 17, iPhone 17 Air (tentative name), iPhone 17 Pro, and iPhone 17 Pro Max, according to TrendForce. The lineup will feature updated designs, improved processor performance, enhanced thermal management, and upgraded imaging capabili
3 min read
Infineon and Kaynes Semicon Collaborate on MEMs Microphone and Advanced Packaging
Infineon Technologies and Kaynes Semicon have signed a Memorandum of Understanding (MoU) to explore collaboration in India’s growing semiconductor market. The partnership will introduce India’s first domestically produced MEMs Microphone, utilizing Infineon’s bare die tec
2 min read
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