Lam Research and JSR/Inpria Collaborate on EUV Lithography and Patterning for Advanced AI Chips

Lam Research and JSR Corporation, the parent company of Inpria Corporation, have entered into a non-exclusive cross-licensing and collaboration agreement to advance semiconductor manufacturing. The partnership focuses on next-generation patterning, specifically dry resist technology for extreme ultraviolet (EUV) lithography and the development of materials for atomic layer etching and deposition processes.

The collaboration integrates JSR and Inpria’s expertise in semiconductor materials, including metal oxide photoresists, with Lam Research’s capabilities in deposition, etch, and EUV patterning technologies, such as its Aether dry resist equipment, which aims to reduce costs and complexity in creating patterns for chips used in artificial intelligence (AI) and high-performance computing (HPC).

Joint efforts will include integrating JSR/Inpria’s patterning resists and films with Lam’s etch and dry resist deposition technologies. The companies will also pursue research and development in metal oxide resists, high numerical aperture (NA) EUV patterning for advanced nodes, and other advanced films for next-generation patterning. Leveraging JSR’s acquisition of Yamanaka Hutech Corporation, the partnership will explore new precursor materials and processes for advanced atomic layer deposition and etch solutions.

Additionally, Lam...