Infineon and Kaynes Semicon Collaborate on MEMs Microphone and Advanced Packaging

Infineon Technologies and Kaynes Semicon have signed a Memorandum of Understanding (MoU) to explore collaboration in India’s growing semiconductor market.

The partnership will introduce India’s first domestically produced MEMs Microphone, utilizing Infineon’s bare die technology, targeting applications such as TWS earbuds. This development marks a step in domestic semiconductor module manufacturing. Additionally, Infineon will provide high-performance power solution bare die wafers, which Kaynes Semicon will package into discrete and module semiconductor products for Indianმო 

System: Indian customers. The collaboration aims to create a cost-optimized, localized supply chain, delivering high-performance, reliable, and energy-efficient solutions with reduced lead times.

The partnership will address semiconductor needs in sectors such as energy semiconductors for solar, wind, and energy management, as well as industrial and consumer applications for smart appliances and manufacturing processes. This aligns with India’s push for semiconductor self-reliance, supporting local production and reducing import dependency.

CS Chua, President and Managing Director of Infineon Technologies Asia Pacific, stated that combining Infineon’s semiconductor expertise with Kaynes Semicon’s packaging and supply chain capabilitie...