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From Mature Nodes to Power Devices: Paresh Bharkhada Outlines Phased Strategy for India's Semiconductor Test Engineering Hub
India Semiconductor

From Mature Nodes to Power Devices: Paresh Bharkhada Outlines Phased Strategy for India's Semiconductor Test Engineering Hub

Paresh Bharkhada, Managing Director at Teradyne India, delivered a motivating keynote at the India Electronics and Semiconductor Association (IESA) Vision Summit 2026, stressing the critical yet often underappreciated role of test engineering in transforming India's semiconductor investments into

6 min read
Semiconductor Veteran Shares Bytes on TSMC Dominance, Foundry Rivalry, Memory Boom-Bust, Open Source and AI-Enhanced EDA
AI

Semiconductor Veteran Shares Bytes on TSMC Dominance, Foundry Rivalry, Memory Boom-Bust, Open Source and AI-Enhanced EDA

In a recent in-depth video conversation with Srinivasa Reddy N, Editor of EEHerald, Dr. Walden (Wally) Rhines, the veteran leader now serving as CEO of Silvaco Group Inc., shared his insights on the evolving and changing dynamics of semiconductor landscape, from geopolitical shifts in supply chai

6 min read
Panasonic Industry Invests 7.5 Billion Yen in Guangzhou Factory for New MEGTRON Production Line to Meet AI Server Demand
News

Panasonic Industry Invests 7.5 Billion Yen in Guangzhou Factory for New MEGTRON Production Line to Meet AI Server Demand

Panasonic Industry Co., Ltd. announced  in Tokyo, Japan, an investment of approximately 7.5 billion yen in Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd. (Guangzhou Factory) to install an additional production line dedicated to manufacturing MEGTRON multi-layer circuit board ma

3 min read
STMicroelectronics Integrates LSM6DSV32X Sensor and ST54L NFC Controller into Qualcomm Snapdragon Wear Elite Platform
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STMicroelectronics Integrates LSM6DSV32X Sensor and ST54L NFC Controller into Qualcomm Snapdragon Wear Elite Platform

STMicroelectronics announced,  its motion-sensing and secure wireless technologies support Qualcomm Technologies’ Snapdragon Wear Elite personal AI platform. The collaboration incorporates ST’s LSM6DSV32X smart inertial module and ST54L NFC controller with embedded secure

3 min read
From Fifth Wave to Agentic AI: Siemens EDA Executive Maps Transformative Path for Silicon Innovation
News

From Fifth Wave to Agentic AI: Siemens EDA Executive Maps Transformative Path for Silicon Innovation

Siemens EDA executive Ruchir Dixit in his keynote address at the IESA Vision Summit 2026 in Bengaluru, outlined a transformative vision for the future of electronics and semiconductor design powered by artificial intelligence. Speaking as Vice President and Country Manager for Siemens EDA India a

5 min read
Lam Capital Eyes Indian Deep Tech Startups to Boost Semiconductor Equipment Performance
Semiconductor and Component Equipment

Lam Capital Eyes Indian Deep Tech Startups to Boost Semiconductor Equipment Performance

In a recent interaction with the EEHerald, Bedwyr Humphreys, Investment Director – Europe at Lam Capital, detailed the venture arm's targeted approach to funding opportunities in India. Humphreys, who leads the funding initiatives for Lam Capital, the investment vehicle associated with Lam

3 min read
Talent, Capital, and Courage Converge: Semiconductor Expert Ganapathy Subramaniam on India's Deep Tech Awakening
News

Talent, Capital, and Courage Converge: Semiconductor Expert Ganapathy Subramaniam on India's Deep Tech Awakening

India's deep tech ecosystem is experiencing a promising surge, transitioning from a phase of limited product-oriented innovation to one marked by tangible progress and robust policy backing, according to Ganapathy Subramaniam, widely known as Gani, the Founding Managing Partner of Yali Capital. G

6 min read
Accellera Approves CDC/RDC Standard 1.0 for Release, Enabling Interoperable Clock and Reset Domain Crossing Verification
News

Accellera Approves CDC/RDC Standard 1.0 for Release, Enabling Interoperable Clock and Reset Domain Crossing Verification

Accellera Systems Initiative announced that its Board of Directors has approved the Standard for IP Abstraction for Clock and Reset Domain Crossing (CDC/RDC) Integration 1.0 for immediate release. The standard is now available for download from the Accellera website. The standard addresses

5 min read
NXP India Announces Season 6 of Tech Startup Challenge for 2026, Targeting Semiconductor and Deep-Tech Startups
For Students

NXP India Announces Season 6 of Tech Startup Challenge for 2026, Targeting Semiconductor and Deep-Tech Startups

NXP Semiconductors has launched the sixth edition of the NXP India Tech Startup Challenge in 2026. The program focuses on providing global visibility and network scalability for technology startups while encouraging technical innovation to strengthen India's ESDM (Electronics System Design and Ma

5 min read
TDK Opens Fifth Regional HQ in Bengaluru as Part of Asia-Pacific Expansion
News

TDK Opens Fifth Regional HQ in Bengaluru as Part of Asia-Pacific Expansion

TDK Corporation announced establishment of its Asia-Pacific Regional Headquarters (APAC RHQ) in Bengaluru, India, marking its fifth regional headquarters after those in Japan, Europe, the Americas, and China. The APAC RHQ will be operated by a new legal entity, TDK Asia-Pacific Pvt. Ltd., to be e

3 min read
Automotive Power Electronics: India Launches Indigenous 30 kW Silicon Carbide-Based Integrated Drive System for EVs
Power Supply

Automotive Power Electronics: India Launches Indigenous 30 kW Silicon Carbide-Based Integrated Drive System for EVs

An indigenously developed 30 kW Silicon Carbide (SiC) based Integrated Drive System for four-wheeler electric vehicles (EVs) was launched at IIT Madras. The launch was performed by S. Krishnan, Secretary of the Ministry of Electronics and Information Technology (MeitY). The compact, liquid

4 min read
NanoIC Releases First Fine-Pitch RDL and D2W Hybrid Bonding Interconnect PDKs for Beyond-2nm Technologies
For Students

NanoIC Releases First Fine-Pitch RDL and D2W Hybrid Bonding Interconnect PDKs for Beyond-2nm Technologies

The NanoIC pilot line, coordinated by imec as part of a European initiative to advance chip technologies beyond 2nm, has released two process design kits (PDKs): one for fine-pitch redistribution layer (RDL) and one for die-to-wafer (D2W) hybrid bonding interconnects. These are the first PDKs of

3 min read
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