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STMicroelectronics Integrates LSM6DSV32X Sensor and ST54L NFC Controller into Qualcomm Snapdragon Wear Elite Platform

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STMicroelectronics announced,  its motion-sensing and secure wireless technologies support Qualcomm Technologies’ Snapdragon Wear Elite personal AI platform.

The collaboration incorporates ST’s LSM6DSV32X smart inertial module and ST54L NFC controller with embedded secure element. These components enable always-on sensing, power efficiency, and secure contactless services for wearables supporting advanced use cases such as activity recognition, health and lifestyle monitoring, secure payments, transportation ticketing, access control including digital car keys, and cellular network connectivity.

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The LSM6DSV32X smart inertial module features machine-learning capabilities for pattern-recognition tasks including activity classification, gesture detection, and context awareness at microamp-level current consumption. It distributes AI processing between the sensor and Snapdragon Wear Elite application processor, offloading the main processor to support continuous low-power sensing. This results in extended battery life, more accurate and frequent tracking including posture and specialized activity metrics, responsive real-time decision-making in the sensor, improved reliability through reduced wake-ups, and optimized data transfer.

The ST54L NFC controller complements Snapdragon Wear Elite’s connectivity suite, providing seamless deployment of multiple contactless services and precise location tracking.

Simone Ferri, Executive Vice President MEMS Sub-Group at STMicroelectronics, stated that the collaboration combines ST’s pre-validated reference designs and software with Snapdragon Wear Elite to offer ready-to-use solutions that accelerate time to market, simplify integration, and enable always-ready smart wearables.

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Dino Bekis, SVP and GM, Wearable AI at Qualcomm Technologies, noted that ST’s ultra-low power sensing and security elements complement the platform’s always-on intelligence and superior connectivity.

The collaboration provides OEMs with comprehensive documentation, development tools, global support, and ecosystem alignment to reduce technical risk and shorten the path from prototype to mass production.

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Srinivasa Reddy N

Editor, Electronics Engineering Herald


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