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NVIDIA Partners with  VLSI EDA Vendors Cadence, Siemens, Synopsys on Agentic AI for Semiconductor and Industrial Design at GTC 2026
News

NVIDIA Partners with VLSI EDA Vendors Cadence, Siemens, Synopsys on Agentic AI for Semiconductor and Industrial Design at GTC 2026

NVIDIA announced at the GTC 2026 conference in San Jose on March 16 collaborations with industrial software providers Cadence, Dassault Systèmes, PTC, Siemens, and Synopsys to integrate NVIDIA CUDA-X, NVIDIA Omniverse, and GPU-accelerated tools into design, engineering, and manufacturing w

5 min read
Mitsui Signs Strategic Partnership Agreement with Kaynes Semicon and AOI Electronics for Semiconductor OSAT Operations in India
India Semiconductor

Mitsui Signs Strategic Partnership Agreement with Kaynes Semicon and AOI Electronics for Semiconductor OSAT Operations in India

Mitsui has entered into a strategic business partnership agreement with Kaynes Semicon Private Limited and AOI Electronics. The agreement coincides with India's "Make in India" policy, which supports expansion of the manufacturing sector, including the allocation of substantial government subsidi

3 min read
Authentic, Indigenous India Semiconductor Manufacturing Rise: CDIL, INFAB, AGNIT, and Monk9
India Semiconductor

Authentic, Indigenous India Semiconductor Manufacturing Rise: CDIL, INFAB, AGNIT, and Monk9

At the recently concluded IESA Vision Summit 2026, I met many global and Indian companies. The event’s major sponsors included leading global semiconductor equipment companies and Indian companies that largely depend on them for market and business growth. Authentic Indian semiconductor com

6 min read
AGNIT Semiconductors Raises $2.6 Million Seed Extension, Targets 1 Lakh GaN Components  and Commercial Shipments from July 2027
India Semiconductor

AGNIT Semiconductors Raises $2.6 Million Seed Extension, Targets 1 Lakh GaN Components and Commercial Shipments from July 2027

Bengaluru-based AGNIT Semiconductors has secured $2.6 million in a Seed Extension funding round led by Shastra VC, with continued participation from existing investors 3one4 Capital and Zephyr Peacock India. IISc incubated AGNIT, which had raised $3.5 million in its initial seed round in 2

3 min read
Imec Launches First-of-Its-Kind European University Consortium on CMOS 2.0 Beyond Traditional Chip Scaling
For Students

Imec Launches First-of-Its-Kind European University Consortium on CMOS 2.0 Beyond Traditional Chip Scaling

Imec has launched a consortium with 26 European university groups to jointly work on the technology roadmap beyond CMOS scaling, designated as CMOS 2.0. The initiative focuses on design automation and chip architecture research for the next generation of chips. It will utilize imec’s

5 min read
CEA-Leti and NcodiN Announce Collaboration to Industrialize 300 mm Silicon Photonics for AI Interconnects
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CEA-Leti and NcodiN Announce Collaboration to Industrialize 300 mm Silicon Photonics for AI Interconnects

CEA-Leti and NcodiN announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process. The announcement was made at OFC. NcodiN, a French deep-tech startup founded in 2023, specializes in nanolaser-enabled photonic interconn

3 min read
Efinix Expands into Indian Market with Gopal Gangatharan as Director of Sales
FPGA

Efinix Expands into Indian Market with Gopal Gangatharan as Director of Sales

US-based FPGA vendor Efinix, which maintains major operations in Asia, is expanding its presence into India. The company has appointed Gopal Gangatharan as Director of Sales to lead its business growth in the country. Efinix is a newer participant in the FPGA sector compared to Intel's Alt

3 min read
Applied Materials and SK hynix Sign Long-Term R&D Deal for AI Memory at New EPIC Center in Silicon Valley
Semiconductor Foundry

Applied Materials and SK hynix Sign Long-Term R&D Deal for AI Memory at New EPIC Center in Silicon Valley

Applied Materials, Inc. and SK hynix Inc. have entered a long-term collaboration agreement to develop next-generation DRAM and high-bandwidth memory (HBM) for AI and high-performance computing applications. The agreement establishes joint R&D programs focused on materials engineering, process

5 min read
NHanced Semiconductors President Robert Patti to Present “Foundry 2.0” Paradigm at Advanced Packaging International Conference
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NHanced Semiconductors President Robert Patti to Present “Foundry 2.0” Paradigm at Advanced Packaging International Conference

The first Advanced Packaging International Conference, scheduled for April 20 to 22 in Brussels, Belgium, will feature a presentation by Robert Patti, president of NHanced Semiconductors, titled “Foundry 2.0: A New Foundation For Semiconductors & Innovation” on April 21. Th

2 min read
India Semiconductor Stories: Full coverage of IESA VS 2026 on EEHerald
India Semiconductor

India Semiconductor Stories: Full coverage of IESA VS 2026 on EEHerald

News Coverage on EEHerald from IESA VS 2026  

10 min read
GlobalFoundries Announces AutoPro 150 eMRAM Availability on Enhanced FDX Platform for Automotive SoCs
Semiconductor Foundry

GlobalFoundries Announces AutoPro 150 eMRAM Availability on Enhanced FDX Platform for Automotive SoCs

GlobalFoundries announced the availability of Auto Grade 1 ready embedded magnetic RAM (eMRAM) technology on its ultra-low power FDX platform, designated as FDX+AutoPro150 eMRAM. The technology is now available for prototyping and is part of GF’s portfolio of non-volatile memory (eNVM) tech

3 min read
NEURA Robotics and Qualcomm Announce Long-Term Strategic Collaboration on Physical AI and Cognitive Robotics
News

NEURA Robotics and Qualcomm Announce Long-Term Strategic Collaboration on Physical AI and Cognitive Robotics

NEURA Robotics and Qualcomm Technologies, have entered a long-term strategic collaboration to advance next-generation robotics and physical AI platforms. The partnership combines Qualcomm Technologies’ AI compute, connectivity, and robotics platforms with NEURA Robotics’ full-sta

4 min read
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