The first Advanced Packaging International Conference, scheduled for April 20 to 22 in Brussels, Belgium, will feature a presentation by Robert Patti, president of NHanced Semiconductors, titled “Foundry 2.0: A New Foundation For Semiconductors & Innovation” on April 21.
The conference program includes more than 40 expert presentations from industry leaders and academic experts, along with technical talks, panel discussions, a poster session, and networking opportunities, focused on how advanced packaging enables system-level semiconductor innovation.
In a preview of his presentation, Patti stated that Gordon Moore predicted a “day of reckoning” for semiconductor scaling in the 1960s, and that day has arrived. He described advanced packaging as a new path for semiconductor innovation that does not rely on traditional scaling, with “Foundry 2.0” at its core as a new business model.
Patti explained that for the past 50 years, the traditional Foundry 1.0 model has centered on scaling smaller transistors on more densely packed chips. Each smaller node has involved higher development costs, higher capital costs, longer development times, expensive design tools, and high risk.
The industry is shifting to advanced packaging to achieve better cost, performance, and SWaP (size, weight, and power) parameters.
Foundry 2.0 represents a fundamental change by combining advanced packaging technologies and material solutions, using interconnect and manufacturing methods typically applied to building semiconductor devices. The next generation of semiconductors will be developed through advanced packaging, additive silicon manufacturing, and true heterogeneous integration to deliver better return on investment, lower development costs, and reduced capital expenditures.
