News
Industrial-Grade Electronics Engineering Reality: Overcoming the Gap Between Rapid Prototyping and Successful Product/Board Launch
In the fast-paced world of electronics innovation, hardware prototyping often appears deceptively straightforward. A weekend spent with an off-the-shelf development board can yield a working proof-of-concept that excites founders, investors, and early team members. Yet, the journey from that init
9 min read
AI-Driven Demand Lifts Global Silicon Wafer Shipments 13.1% Year-on-Year in Q1 2026
The SEMI Silicon Manufacturers Group (SMG) reported that worldwide silicon wafer shipments rose 13.1% year-on-year to 3,275 million square inches (MSI) in the first quarter of 2026, compared to 2,896 MSI in the same quarter of 2025. Shipments fell 4.7% sequentially from 3,437 MSI in the fourth qu
2 min read
Altair Semiconductor Completes Spinoff from Sony, Secures $50 Million Funding Led by Pitango for 5G IoT and Physical AI
Altair Semiconductor announced the successful completion of its transition to an independent company following a strategic spinoff from Sony Semiconductor Solutions Corporation. The transaction, led by Pitango Group, secured $50 million in initial funding. Sony will remain a shareholder. T
3 min read
L&T Semiconductor Technologies Joins imec Automotive Chiplet Program
L&T Semiconductor Technologies has announced its participation in the imec Automotive Chiplet Program (ACP), a pre-competitive research initiative that brings together stakeholders across the global automotive value chain. The ACP evaluates chiplet architectures and advanced packaging
4 min read
SRMIST Signs MoU with IVP Semiconductor for Chip Design and Semiconductor Research Collaboration
SRM Institute of Science and Technology (SRMIST), Kattankulathur, entered into a Memorandum of Understanding (MoU) with IVP Semiconductor on 22nd April 2026. The agreement aims to advance indigenous semiconductor research, chip design, and talent development in India, with a focus on research and
3 min read
Samsung Pitches 4nm FinFET Foundry Process as Ideal “Sweet Spot” Between Mature and Cutting-Edge Nodes
Samsung Foundry is actively promoting its 4nm process technology as a practical midway solution for chip designers who want advanced performance without the extreme costs and risks of the latest 2nm nodes. In a new blog post on its semiconductor website, Samsung highlights the 4nm FinFET p
3 min read
The Unsung Hero of AI Chips: How ATE is Revolutionizing Semiconductor Testing in the Intelligent Era
Innovation fuels semiconductor manufacturing, yet testing and quality assurance remain its unsung hero. While new features of advanced chip capture attention, device reliability and consistent performance under all operating conditions ultimately determine real-world success. Extreme automation a
9 min read
UB-Led Study Enhances Visible Light Absorption in Chiral Semiconductors
A research team at University at Buffalo has developed a method to improve visible light absorption in chiral semiconductors, materials whose structures are left- or right-handed similar to many biological molecules. In a study published in Nature Communications, researchers combined a chiral sem
4 min read
CVD Equipment Corporation Grows Single Crystal SiC Boules on PVT Systems with Stony Brook University
Semiconductor Equipment maker CVD Equipment announced the successful growth of single crystal silicon carbide (SiC) boules using its Physical Vapor Transport (PVT) Systems. The boules were characterized by Stony Brook University (SBU) as part of the new onsemi Research Center for Wide Bandgap Mat
2 min read
Teradyne Acquires TestInsight to Accelerate Time to Market for AI and Data Center Devices
Teradyne acquired TestInsight, a provider of semiconductor test development, validation, and conversion software. The acquisition expands Teradyne’s position in design-to-test software. TestInsight’s tools and team will support the development of test solutions on Teradyne
3 min read
Syenta Raises A$37 Million Series A for Localized Electrochemical Manufacturing and Advanced Chip-to-Chip Interconnects
Syenta, a semiconductor company developing advanced packaging solutions, has raised A$37 million (US$26 million) in Series A funding. The round was led by Playground Global and Australia’s National Reconstruction Fund (NRF), with participation from existing investors Investible, Salus Ventu
4 min read
IIT Madras Develops Indigenous Silicon Photonics PDK and Universal PPIC Test Engine
S. Krishnan, Secretary, Ministry of Electronics and Information Technology (MeitY), Government of India launched indigenously developed Silicon Photonics technology solutions, including a Silicon Photonics Process Design Kit (PDK) and a Universal Programmable Photonic ICs (PPIC) Test Engine at II
3 min read
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