L&T Semiconductor Technologies Joins imec Automotive Chiplet Program

L&T Semiconductor Technologies has announced its participation in the imec Automotive Chiplet Program (ACP), a pre-competitive research initiative that brings together stakeholders across the global automotive value chain.

The ACP evaluates chiplet architectures and advanced packaging technologies to address automakers’ requirements for performance, functional safety, reliability and lifecycle management, while supporting flexibility, scalability and cost efficiencies of chiplet-based systems.

For decades, automakers have used semiconductors in vehicle electronics, but traditional monolithic SoC designs face growing challenges from the compute and bandwidth needs of advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs) and next-generation in-vehicle infotainment (IVI). Chiplets consist of modular silicon building blocks optimized for specific functions and connected through advanced 2.5D and 3D packaging. These provide an alternative approach offering higher performance per watt, faster time-to-market and greater supply-chain resilience.

Sandeep Kumar, Chief Executive of LTSCT, stated: “Chiplets represent a fundamental shift in how performance and integration are delivered in automotive systems. As vehicle architectures become increasingly software-defined, modular and scalable hardware becomes critical.”