Syenta Raises A$37 Million Series A for Localized Electrochemical Manufacturing and Advanced Chip-to-Chip Interconnects

Syenta, a semiconductor company developing advanced packaging solutions, has raised A$37 million (US$26 million) in Series A funding. The round was led by Playground Global and Australia’s National Reconstruction Fund (NRF), with participation from existing investors Investible, Salus Ventures, Jelix Ventures, and Wollemi Capital. This brings the company’s total funding to A$51.1 million (US$36.4 million).

As part of the round, Pat Gelsinger, General Partner at Playground Global and former Chief Executive Officer of Intel, will join Syenta’s board of directors. The funding will support commercialization of the company’s technology, preparation for high-volume production, and establishment of US operations in Arizona.

Syenta is developing Localized Electrochemical Manufacturing (LEM) technology to produce High-Resolution Interconnects for chip-to-chip connectivity. The process combines deposition and patterning into a single step using a stamp electrode with a dielectric pattern that defines localized electrochemical cells for precision metal deposition.

The interconnects are sub-micron scale and manufactured on large packages exceeding 1000 mm², with 3x the throughput of existing fabs. Early results show micron-scale interconnects with up to 40% fewer process steps, no requirement for redesign of existing fabrication infrastr...