Memory
HBM forecast by Yole: To reach US$14 billion by 2024 at CAGR of 38% through 2029
The High-Bandwidth Memory (HBM) semiconductor market is set for a substantial growth, with latest Yole Group forecasting revenues to reach US$14 billion by 2024 and an impressive CAGR of approximately 38% through 2029. As demand for high-speed memory technologies surges, particularly fueled by A
4 min read
SureCore and Intrinsic collaborate to speed up ReRAM' Time-to-Market
Intrinsic and SureCore have formed a collaborative partnership to accelerate the time to market for Intrinsic's innovative Resistive Random-access Memory (ReRAM) technology. Intrinsic's ReRAM is the perfect solution for SoC developers who require an embedded non-volatile storage solution for 22nm an
4 min read
Qualcomm validates SK hynix LPDDR5T for compatibility with Snapdragon 8 Gen 3
SK hynix has recently commenced the commercialization of the LPDDR5T (Low Power Double Data Rate 5 Turbo), which is acclaimed as the fastest DRAM for mobile devices worldwide, boasting an impressive speed of 9.6Gbps.
4 min read
Everspin expanded industrial STT-MRAM with a new 4Mb capacity point
MRAM specialist Everspin expanded its EMxxLX STT MRAM product family for applications such as industrial IoT, network and enterprise infrastructure, process automation and control, aeronautics and avionics, medical devices, gaming, and FPGA configuration. The new extended EMxxLX family designed to
3 min read
Study finds revenues of DRAM module makers in 2022 declined by 4.6%
The global sales of DRAM modules in 2022 experienced a 4.6% YoY decline, amounting to US$17.3 billion, due to high inflation affecting consumer demand for electronic products, as per the finding by TrendForce. The revenue performance of module makers varied depending on the domains they supplied.
4 min read
ISO26262 ASIL Grade D safety certified secure flash memory device
Electronic engineers are in hunt for semiconductor memory devices to store date and code with built-in security features. For automotive domain there is one such component from Winbond. Winbond has announced its secure flash memory device W75F is now ISO26262 ASIL Grade D safety certified and is com
3 min readMicron ready to mass produce UFS multichip package with LPDDR5 DRAM
Micron announced mass production ready industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. uMCP5 enables mobiles phones to process data-intensive 5G workloads faster and at low power consumption. The multichip package constitute Micron’s LPDDR5 memory,
5 min readSK Hynix buying memory biz of Intel
Intel is getting away from its memory business by selling it to SK Hynix for US$ 9 billion, but keeps it's optane persistence memory with it. SK Hynix to acquire Intel' NAND memory and storage business covering NAND SSD business, the NAND component and wafer business, and the memory semiconduc
3 min readAI demands a different procesor unit, not the present CPU, GPU and FPGA turbo
Moore's law is no more that valid in terms of costs, and the present mass-used CPU architectures hardly handles streaming real-time high-bandwidth data without latency. They also consume lot of power. The long lasted Von Neumann architecture is sliding towards obsolescence. GPUs and FPGA accele
3 min readSTT and TEL collaborating on "SRAM and DRAM replacing MRAM"
Japan-based semiconductor equipment vendor Tokyo Electron (TEL) and the MRAM memory technologyy expert Spin Transfer Technologies (STT) have agreed to collaborate on next-generation SRAM and DRAM-class ST-MRAM devices. They are jointly putting effort to increase the speed, density, and endurance
3 min readToshiba selects a bidder to sell its memory semiconductor biz
Toshiba announced that its board of directors have selected the consortium of Innovation Network Corporation of Japan, Bain Capital Private Equity L P, and Development Bank of Japan as a preferred bidder for its memory semiconductor business. Toshiba stated in its release "Consortium has presente
2 min read256 Kbit FRAM with SPI interface operates up to temp of up to 125°C
Fujitsu announced its new FRAM chips MB85RS128TY and MB85RS256TY to withstand operating temperature of up to 125°C and is qualified according to the AEC Q100 industry standard, making them usable for automotive electronics. FRAM enables data collection by sensors reliably stored without a delay.
2 min read
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