Everspin expanded industrial STT-MRAM with a new 4Mb capacity point
Date: 26/10/2023
MRAM specialist Everspin expanded its EMxxLX STT MRAM product family for applications such as industrial IoT, network and enterprise infrastructure, process automation and control, aeronautics and avionics, medical devices, gaming, and FPGA configuration. The new extended EMxxLX family designed to deliver performance, endurance, and retention and is now available in densities from 4 to 64 megabits with new, smaller packaging for the 4-to-16-megabit products.
The new 5mm x 6mm DFN package is an area savings of 37% over the existing offering. In addition to the new capacity and smaller packaging, Everspin is delivering an extended temperature range in the EMxxLX products of - 40°C to 105°C. The EMxxLX family can replace alternative solutions, such as SRAM, BBSRAM, FRAM, NVSRAM, and NOR flash devices.
One of the key feature of Everspin's STT MRAM is: Full read and write bandwidth of 400 megabytes per second via eight I/O signals with a clock frequency of 200MHz.
Everspin says EMxxLX family is a versatile solution that can replace alternative memory devices such as SRAM, BBSRAM, FRAM, NVSRAM, and NOR flash. They are excited to bring these advancements to the market and provide customers with the highest combination of performance, endurance, and retention in the industry.
"In the fast-growing Industrial IoT and embedded systems markets, customers, more than ever, need to protect critical system data under all conditions, particularly in the event of power loss and without concern for wear out or data integrity issues," emphasized Sanjeev Aggarwal, president, and CEO of Everspin Technologies. "That's why we are proud to announce the expansion of our EMxxLX MRAM product line, now featuring not only SRAM-like performance with low latency and the ability to maintain memory without requiring power but also an extended temperature range to cater to diverse environmental demands. With the addition of a 4Mb capacity option, our MRAM devices provide even more options to select the optimal density solutions. They continue to deliver extremely high endurance, remain compatible with other memory types, and offer ease of integration into customers' designs."
The smaller DFN package with a 4Mb capacity option is now available for sampling and the production of this option is set to begin in the first quarter of 2024. They are currently open to receiving production orders for the extended temperature range options of 8Mb through 64Mb capacity.
For more information visit www.everspin.com
