Micron ready to mass produce UFS multichip package with LPDDR5 DRAM

Micron announced mass production ready industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. uMCP5 enables mobiles phones to process data-intensive 5G workloads faster and at low power consumption. The multichip package constitute Micron’s LPDDR5 memory, high-rel NAND and UFS 3.1 controller. Smart phones featuring this memory do handle image recognition, advanced artificial intelligence (AI), multicamera support, augmented reality (AR) and high-resolution displays lot better. “Moving 5G’s potential from hype to reality will require smartphones that can support the immense volumes of data flowing through the network and next-gen applications,” said Raj Talluri, senior vice president and general manager of Micron’s Mobile Business Unit. “Our uMCP5 combines the fastest memory and storage in a single package, unleashing new possibilities for 5G’s disruptive, data-rich technologies right at consumers’ fingertips.” With LPDDR5, Micron says it has significantly increased memory bandwidth from 3,733 to 6,400 megabits per second (Mb/s), enabling seamless, instant experiences for mobile users, even when using data-heavy features. “5G provides smartphones with unprecedented multigigabit speeds to connect with the cloud,” said Ziad Asghar, vice president of product management at Qualcomm Technologies, Inc. “We're excited that uMCP5 is...