Memory
Micron Starts High-Volume Production of HBM4 for NVIDIA Vera Rubin, PCIe Gen6 SSD, and SOCAMM2
Micron Technology announced at recently held NVIDIA GTC 2026 that it has begun high-volume shipment of its HBM4 36GB 12H memory in the first quarter of calendar year 2026. This product is designed for the NVIDIA Vera Rubin platform. It achieves pin speeds exceeding 11 Gb/s, delivering bandwidth g
3 min read
SK hynix Develops 1c LPDDR6 6th-Gen 10nm-Class DRAM for On-Device AI Applications
SK hynix announced on that it has successfully developed a 16Gb LPDDR6 DRAM based on the sixth-generation 10nm-class (1c) process technology. The company unveiled the product at CES in January and recently completed the world’s first validation of 1c LPDDR6 development. SK hynix plans to co
3 min read
Applied Materials and SK hynix Sign Long-Term R&D Deal for AI Memory at New EPIC Center in Silicon Valley
Applied Materials, Inc. and SK hynix Inc. have entered a long-term collaboration agreement to develop next-generation DRAM and high-bandwidth memory (HBM) for AI and high-performance computing applications. The agreement establishes joint R&D programs focused on materials engineering, process
5 min read
Everspin Launches UNISYST MRAM Family as Unified Code-and-Data Memory for Edge AI and Mission-Critical Systems
Everspin Technologies announced the UNISYST MRAM family, a new generation of unified memory that combines code storage and data memory in a high-density, non-volatile architecture. UNISYST extends Everspin’s PERSYST MRAM platform to higher densities and serves as a migration path from seria
3 min read
GigaDevice Expands GD25UF Series SPI NOR Flash Densities from 8Mb to 256Mb for 1.2V Ultra-Low Power Applications
GigaDevice announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now covering 8Mb to 256Mb. The series operates between 1.14V and 1.26V, aligning with the shift to 1.2V operating voltage in leading-edge SoCs and processors for higher energy efficiency. This
3 min read
GlobalFoundries Announces AutoPro 150 eMRAM Availability on Enhanced FDX Platform for Automotive SoCs
GlobalFoundries announced the availability of Auto Grade 1 ready embedded magnetic RAM (eMRAM) technology on its ultra-low power FDX platform, designated as FDX+AutoPro150 eMRAM. The technology is now available for prototyping and is part of GF’s portfolio of non-volatile memory (eNVM) tech
3 min read
Everspin Completes Production Qualification for 64Mb xSPI STT-MRAM, Advances 128Mb and 256Mb Densities for High-Reliability Applications
Everspin Technologies in its release shared continued advancements of its high-reliability PERSYST xSPI STT-MRAM portfolio. The company has completed full production qualification for its 64Mb xSPI STT-MRAM device under the AEC-Q100 Grade 1 specification. It is now available for customer orders a
4 min read
Semiconductor Veteran Shares Bytes on TSMC Dominance, Foundry Rivalry, Memory Boom-Bust, Open Source and AI-Enhanced EDA
In a recent in-depth video conversation with Srinivasa Reddy N, Editor of EEHerald, Dr. Walden (Wally) Rhines, the veteran leader now serving as CEO of Silvaco Group Inc., shared his insights on the evolving and changing dynamics of semiconductor landscape, from geopolitical shifts in supply chai
6 min read
Micron Begins Commercial Production at Sanand Facility, Marking India's Entry into Memory Chip Assembly
Micron Technology held the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, marking the first such site in India. The facility converts advanced DRAM and NAND wafers from Micron's global network into finished memory and storage products, serving worldwide customer
5 min read
Indian Semiconductor Firm Sahasra Dispatches First MicroSD Shipment to Japan Under YAMAYA Distribution Deal
Sahasra Semiconductors Private Limited (SSPL), part of the Sahasra Group, has dispatched its first shipment of MicroSD cards to Japan on February 17, 2026. The shipment occurs under a distribution agreement with YAMAYA Electronics. The partnership originated from interactions at Semicon In
2 min read
Avalanche Technology Announces VNX+ Storage Module with Space Grade MRAM for Military and LEO Applications
Avalanche Technology announced the introduction of its next-generation VNX+ storage module, designed for military and Low Earth Orbit (LEO) environments using the company’s Space Grade MRAM. The module is built with Avalanche’s high-density Space Grade MRAM and a Lattice Certus
3 min read
SST and UMC Release 28nm SuperFlash Gen 4 Automotive Grade 1 Platform for Vehicle Controllers
Silicon Storage Technology (SST), a subsidiary of Microchip Technology and United Microelectronics Corporation announced the completion of full qualification and immediate release to production of SST’s embedded SuperFlash Gen 4 (ESF4) with full Automotive Grade 1 (AG1) capability on
3 min read
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