Component Engineering
Qnity Introduces Eon EUV Photoresist Family for Advanced Node Semiconductor Manufacturing
Qnity Electronics announced the introduction of the Eon EUV photoresist product family, expanding its offerings for extreme ultraviolet (EUV) lithography. Randal King, Chief Technology and Sustainability Officer at Qnity, stated: “EUV lithography has become the foundation for enablin
3 min read
Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP for AI Infrastructure
Omni Design Technologies, a provider of Wideband Signal Processing solutions, announced advancements in the development of its 200G-class Co-Packaged Optics (CPO) analog front-end (AFE) IP using an advanced 3nm process. The development includes a high-swing linear transmit (TX) driver and
2 min read
Quantum Computing Completes $110 Million Acquisition of Luminar Semiconductor
Quantum Computing, a company focused on quantum optics and integrated photonics technology, announced on February 2, 2026, the completion of its acquisition of Luminar Semiconductor, (LSI), a wholly owned subsidiary of Luminar Technologies. The transaction was an all-cash deal valued at $110 mill
3 min read
STMicroelectronics Expands Multi-Year Multi-Billion Dollar AWS Partnership for AI and Cloud Data Center Infrastructure
STMicroelectronics announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement covering several product categories.The agreement establishes STMicroelectronics as a strategic supplier of advanced semiconductor te
3 min read
Global Semiconductor Sales Reach $791.7 Billion in 2025 with 25.6% Annual Growth, Projected to Hit $1 Trillion in 2026
The Semiconductor Industry Association (SIA) reported that global semiconductor sales totaled $791.7 billion in 2025, reflecting a 25.6% increase from the $630.5 billion recorded in 2024. Fourth-quarter sales in 2025 reached $236.6 billion, up 37.1% compared to the fourth quarter of 2024 a
3 min read
Valeo and Anritsu Partner to Develop Digital Twin Validation for Software-Defined Vehicle Telematics
Valeo and Anritsu announced a collaboration to advance virtual validation capabilities for software-defined vehicles, focusing on telematics units and cellular connectivity. The partnership aims to enable more cost-efficient and scalable software development processes by creating realistic d
4 min read
Phison Selects Andes RISC-V Cores for aiDAPTIV+ AI Storage Solution in Edge and Data Center Deployments
Phison Electronics Corporation and Andes Technology Corporation announced that Phison’s first aiDAPTIV+ AI solution, internally code-named E28, is powered by Andes’ N45 and N25F RISC-V processor cores. Phison’s aiDAPTIV+ platform uses a hybrid storage-based memory extensi
3 min read
Mitsubishi Electric Secures Contract for Japan’s Next-Generation Defense Satellite Communications System
Mitsubishi Electric Corporation announced it has been awarded a contract by the Japan Ministry of Defense to develop and manufacture a next-generation defense communications satellite and to design the associated ground system. The contract, signed on February 6, 2026, covers the con
3 min read
Kneron Face Recognition Module Achieves Zero-Error Results in ISO 30107 and 19795 Biometric Security Testing
Kneron announced that its Face Recognition Module v1.0 has recorded zero-error performance in independent testing against the ISO/IEC 30107 (Presentation Attack Detection) and ISO/IEC 19795 (Performance Testing) standards. The month-long evaluation was performed by Fime, a laboratory accre
3 min read
Marvell Completes Acquisition of Celestial AI to Expand Optical Interconnect Capabilities for AI Data Centers
Marvell Technology, announced it has completed the acquisition of Celestial AI, a company specializing in optical interconnect technology for scale-up connectivity.Celestial AI brings its Photonic Fabric optical interconnect technology, which is designed to deliver high-bandwidth and low-latency
3 min read
Bourns Expands Macnica Distribution Partnership to Cover Entire APAC Region including India for Electronic Components
Bourns, announced it has extended its distributor relationship with Macnica to cover the entire Asia-Pacific (APAC) region, effective immediately. Macnica, previously appointed as Bourns’ distributor for Japan in 2024, now holds full-line distribution responsibility across China, Taiwa
2 min read
Broadcom Unveils First Wi-Fi 8 Access Point and Switch Solution for Enterprise AI Networks
Broadcom announced the industry’s first Wi-Fi 8 access point (AP) and switch solution designed with a unified architecture for enterprise networks supporting AI workloads. The solution builds on Broadcom’s Wi-Fi 8 radios introduced in October 2025 and includes two new components
4 min read
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