Component Engineering
Mitsubishi Electric and GE Vernova sign MOU to collaborate on power semiconductors for HVDC systems
Mitsubishi Electric Corporation announced the signing of a memorandum of understanding (MOU) with GE Vernova, Inc., based in Cambridge, Massachusetts, USA, to enhance cooperation on power semiconductors for high-voltage direct-current (HVDC) transmission systems. The agreement stems from the &ldq
2 min read
Eaton and Siemens Energy collaborate to accelerate data center construction
Eaton and Siemens Energy announced a partnership to develop data centers with integrated on-site power generation and standardized modular systems. The collaboration aims to meet the increasing demand for AI and cloud computing by enabling faster data center construction.
3 min read
Samsung and Johns Hopkins APL develop peltier cooling technology for data centers
Samsung Electronics, in collaboration with the Johns Hopkins Applied Physics Laboratory (APL), published a research paper titled “Nano-Engineered Thin-Film Thermoelectric Materials Enable Practical Solid-State Refrigeration” in Nature Communications. The paper outlines the development
2 min read
Murata to display sensing technologies at sensors converge 2025 in Santa Clara
Murata Manufacturing Co., Ltd. will exhibit at Sensors Converge 2025, held June 24–26 in Santa Clara, California, at Booth #716. The company will showcase sensing technologies for various applications, with subject matter experts available to demonstrate products and discuss industry uses.
2 min read
Mitsubishi Electric initiates CO2 capture demonstration with ITRI technology in Japan
Mitsubishi Electric Corporation announced on June 9, 2025, the start of a demonstration to capture CO2 from flue gas using a machine developed by Taiwan’s Industrial Technology Research Institute (ITRI). The demonstration, located at Mitsubishi Electric’s Advanced Technology R&D C
3 min read
Chips for everyone: Learning VLSI chip design from idea to tape-out
Learn VLSI chip from idea to tape-out on your personal computer/notebook through this easy to learn, step by step practical guide in 7 modules.
5 min read
Veolia receives Intel’s 2025 EPIC supplier award
Veolia announced it has been named a recipient of Intel’s 2025 EPIC Supplier Award. Veolia is one of 37 suppliers recognized from Intel’s global supply chain. The award acknowledges suppliers for their performance in excellence, partnership, inclusion, and continuous improvement over
2 min read
MangoBoost demonstrates multi-node LLM training on AMD GPUs in MLPerf training v5.0
MangoBoost announced its MLPerf Training v5.0 submission, validating the scalability of large-scale AI training on AMD Instinct MI300X GPUs. Using 32 GPUs across four nodes, MangoBoost fine-tuned the Llama2-70B-LoRA model in 10.91 minutes, achieving 95–100% scaling efficiency. The submissio
2 min read
Keysight and Synopsys launch AI-powered RF design migration flow for TSMC N6RF+ to N4P transition
Keysight and Synopsys announced an AI-powered RF design migration flow to facilitate the transition from TSMC’s N6RF+ to N4P process node. The solution integrates Keysight’s Electromagnetic Simulator and Synopsys’ AI-driven RF design migration tools with TSMC’s Analog Desi
2 min read
Belden introduces new products for secure power connections and edge-to-cloud data management
Belden announced new products designed for secure and reliable performance in critical applications. The releases include solutions for data acquisition, transmission, orchestration, and management.For data acquisition and transmission, Belden introduced the FiberExpress XHD Fiber Patch
3 min read
GCT Semiconductor and Iridium collaborate to integrate NTN direct service into GDM7243SL chipset
GCT Semiconductor and Iridium Communications announced a memorandum of understanding to integrate Iridium’s NTN Direct service into GCT’s GDM7243SL 4G/5G chipset. The collaboration aims to develop a Narrowband Internet of Things (NB-IoT) chipset compliant with 3GPP Release 19 st
1 min read
ROHM introduces AI-equipped MCUs for on-device fault prediction
ROHM has developed AI-equipped microcontrollers (MCUs), the ML63Q253x-NNNxx and ML63Q255x-NNNxx, designed for fault p
5 min read
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