Component Engineering
Wind River and Hyundai Mobis Partner to Launch Mobis Development Studio for Software-Defined Vehicles
Wind River, an Aptiv company, and Hyundai Mobis have collaborated to develop Mobis Development Studio, a cloud-based software development environment for software-defined vehicles (SDVs). The platform integrates Hyundai Mobis’ vehicle development infrastructure with Wind River Studio Develo
2 min read
Digi Z45 Industrial Controller Gains T-Mobile Certification for IoT Automation
Digi International announced that its Digi Z45 Industrial Controller, powered by Digi Axess, is now certified for use on T-Mobile’s cellular network. This certification enables industries to utilize cellular-based automation for monitoring and control.
1 min read
Siemens and ASE Partner to Develop 3Dblox Workflows for VIPack Platform Using Innovator3D IC
Siemens Digital Industries Software announced a collaboration with Advanced Semiconductor Engineering, Inc. (ASE), a global leader in semiconductor manufacturing services, to develop 3Dblox-based workflows for ASE’s VIPack platform using Siemens’ Innovator3D IC solution, which is full
2 min read
ROHM and Infineon Partner on SiC Power Semiconductor Packages to Boost Design Flexibility
ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on silicon carbide (SiC) power semiconductor packages for applications including on-board chargers, photovoltaics, energy storage systems, and AI data centers. The partnership focuses on enabling each compa
2 min read
MediaTek and TSMC Collaborate on 2nm N2P Chip for Enhanced Performance and Efficiency
MediaTek announced its collaboration with TSMC to develop a chip using TSMC’s N2P process, a 2nm technology featuring a nanosheet transistor structure. The chipset, MediaTek’s flagship system-on-chip (SoC), has been taped out, with volume production scheduled for late 2026. This partn
1 min read
AMD and Cohere Deepen AI Collaboration to Enable Enterprise and Sovereign AI Deployments on AMD Instinct GPUs
AMD announced an expanded collaboration with Cohere, allowing Cohere’s customers to deploy the company’s AI offerings—Command A, Command A Vision, Command A Translate, and North—on AMD Instinct GPU-powered infrastructure. The partnership aims to provide enterprise an
3 min read
onsemi Acquires Aura Semiconductor's Vcore Power Tech to Bolster AI Data Center Power Management
onsemi announced an agreement with Aura Semiconductor to acquire rights to its Vcore power technologies, including associated intellectual property (IP) licenses. The deal aims to expand onsemi’s power management portfolio and roadmap, targeting the full power tree in AI data center applica
2 min read
Vishay Expands Gen 7 FRED Pt Hyperfast Rectifiers for EV and Industrial Power Applications
Vishay released four 1200 V FRED Pt hyperfast rectifiers in the eSMP series SlimSMA HV (DO-221AC) package, expanding its Gen 7 platform for industrial and automotive applications. The 1 A and 2 A devices, VS-E7JX0112-M3, VS-E7JX0212-M3, VS-E7JX0112HM3, and VS-E7JX0212HM3, offer reverse recovery c
6 min read
Littelfuse Unveils IX3407B Isolated Gate Driver for High-Power Applications in Motor Drives and Solar Inverters
Littelfuse, announced the release of the IX3407B, a single-channel, galvanically isolated gate driver designed for high-voltage power applications. The driver supports motor drives, inverters, and industrial power supplies with up to 7 A peak source and sink output current through separate output
3 min read
GlobalFoundries and Egis Collaborate on Advanced dToF Sensors for Mobile and IoT Smart Sensing Applications
lobalFoundries announced a partnership with Egis Technology at its annual Technology Summit in Shanghai, China, to deliver direct time-of-flight (dToF) sensors on GF’s 55nm platform for smart mobile, IoT, and automotive applications. The first-generation front-side illuminated (FSI)
3 min read
eSIM Device Shipments to Surpass 633 Million in 2026, Fueled by Chinese Smartphone Market and SGP.32 IoT Advancements
ABI Research, a global technology intelligence firm, projects that eSIM-enabled device shipments will reach 403 million for consumer devices and 140 million for IoT devices in 2025, totaling over 633 million by 2026. This growth follows a recovery in the smartphone market, with year-on-year decli
3 min read
Qorvo launches TDD Beamformer IC for Compact Ku-Band SATCOM Terminals with Enhanced Efficiency
Qorvo announced the AWMF-0247, a Ku-band beamformer integrated circuit (IC) designed for time-division duplexing (TDD) in compact, power-sensitive satellite communication (SATCOM) terminals. The TDD architecture allows a single antenna array to handle both transmit and receive functions, reducing
3 min read
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