Siemens Digital Industries Software announced a collaboration with Advanced Semiconductor Engineering, Inc. (ASE), a global leader in semiconductor manufacturing services, to develop 3Dblox-based workflows for ASE’s VIPack platform using Siemens’ Innovator3D IC solution, which is fully certified for the 3Dblox standard.
The collaboration validated 3Dblox workflows for three VIPack technologies: Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC. ASE’s VIPack platform consists of six core packaging technology pillars within an integrated co-design ecosystem, enabling vertically integrated package solutions. It leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to support high-density, high-performance multi-chip integration.
Siemens’ Innovator3D IC solution supports rapid design assembly exploration, enabling ASE to read and write 3Dblox definitions for VIPack technologies. This facilitates EDA tool flexibility, helping customers address package design challenges and reduce time-to-market. The 3Dblox standard and Innovator3D IC support System Technology Co-optimization (STCO) for chiplet-based heterogeneous integration using ASE’s advanced packaging technologies.
The collaboration focuses on streamlining semiconductor package design and verification through 3Dblox, ensuring open interoperability. For more information on Siemens’ Innovator3D IC software, visit https://eda.sw.siemens.com/en-US/ic-packaging/innovator3d-ic/.
