Component Engineering
Cornell and Michigan Professors Awarded 2025 Semiconductor Research Honors for AI Chip Innovation and US Tech Leadership
The Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) announced the recipients of the 2025 University Research Awards on Thursday. Huili Grace Xing, the William L. Quackenbush Professor of Electrical and Computer Engineering at Cornell University with a
4 min read
U.S. Electronics Manufacturing 2025 Report: 5.2 Million Jobs, $1.8 Trillion Output, Supply Chain Resilience
The Global Electronics Association released a report titled “Powering the U.S. Economy: The Economic Reach of Electronics Manufacturing” that details U.S. electronics manufacturing supports 5.2 million American jobs, contributes $853 billion to U.S. gross domestic product, and generat
3 min read
Cadence Secure-IC Acquisition Embedded Cybersecurity IP Automotive Data Center IoT Security
Cadence completed the acquisition of Secure-IC, a provider of embedded security IP, security solutions, and security evaluation tools and services. The combination integrates Cadence’s IP and subsystem design with Secure-IC’s embedded cybersecurity solutions. The acquisit
1 min read
Valeo 2CRSi Partnership 2025: Edge Data Centers Liquid Cooling, AI Infrastructure, 5G Deployment
Valeo and 2CRSi announced a strategic partnership to develop liquid cooling solutions for edge computing environments. The collaboration combines Valeo’s expertise in high-efficiency heat exchange, system integration, and operation across wide temperature ranges with 2CRSi’s se
2 min read
AMD Finalizes ZT Systems Divestiture to Sanmina Amid AI Data Center Manufacturing Surge
AMD completed its divestiture of the ZT Systems U.S.-headquartered data center infrastructure manufacturing business to Sanmina. Under the agreement, AMD retains ZT Systems’ design and customer enablement teams to support the quality and time-to-deployment of AMD AI systems for
2 min read
Broadcom Ships Tomahawk6 – Davisson, Industry’s First 102.4-Tbps CPO Ethernet Switch for AI Networking
Broadcom. has begun shipping the Tomahawk 6 – Davisson (TH6-Davisson), its third-generation Co-Packaged Optics (CPO) Ethernet switch, designed for AI networking. The BCM78919 device delivers a switching capacity of 102.4 terabits per second, operating at 200 Gbps per channel with 16 x 6.4 T
2 min read
Creonic Enhances Doppler Channel IP Core for Satellite Communication with Broader Frequency and Sampling Ranges
Creonic GmbH, a provider of IP cores for communication systems, has updated its Doppler Channel emulation IP core. The update extends support to satellite frequency bands including L, S, C, X, Ku, and Ka, enabling simulation of communication links across various scenarios. The core now sup
1 min read
QuickLogic Secures $1M eFPGA Hard IP Contract for Data Center ASIC Design
QuickLogic Corporation, a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse, and ruggedized FPGAs, has announced a $1 million contract for its eFPGA Hard IP to be used in a high-performance Data Center ASIC. The ASIC will be fabricated on a 12 nm process technolog
2 min read
YES Secures Orders for VeroTherm and VeroFlex Systems to Support AI-Driven 3D Chip Stacking
Yield Engineering Systems (YES) announced receiving multiple orders for its VeroTherm and VeroFlex reflow systems from a major memory supplier. These systems are designed to enable 3D stacking of memory and logic chips for high-performance AI accelerators, particularly for large language model (L
2 min read
Innovative Automotive LED Solutions by Edison Opto Shine at Electronica India 2025
At Electronica India 2025, Taiwan-based optoelectronics manufacturer Edison Opto showcased its innovative range of LED products for automotive and other applications. The company highlighted its professional neon lighting strips, designed for flexible automotive use. These seamless, dot-less stri
2 min read
Siemens Enhances Simcenter Testlab with AI-Driven Modal Testing and Automation Features
Siemens Digital Industries Software announced updates to its Simcenter Testlab software, incorporating AI-assisted workflows and automation to streamline physical testing processes. The updates enable faster modal analysis, automated data processing, and compliance with industry standards.
3 min read
VeriSilicon Launches FD-SOI Wireless IP Platform for IoT and Consumer Electronics Connectivity
VeriSilicon introduced a wireless IP platform based on GlobalFoundries’ 22FDX (22nm FD-SOI) process technology, designed for developing energy-efficient, integrated chips for IoT and consumer electronics. The platform supports wireless connectivity standards including Bluetooth Low Energy (
2 min read
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