Here below market research forecast for ASIC SoC , AI in smart appliances, commercial security system and ULP microcontroller from various sources:
The global custom System-on-Chip (SoC) and Application-Specific Integrated Circuit (ASIC) market, valued at USD 27 billion in 2024, is projected to grow to USD 43.39 billion by 2030, with a compound annual growth rate (CAGR) of 8.23%, according to a report by ResearchAndMarkets.com.
The increasing use of Internet of Things (IoT) devices is driving demand for custom SoCs, which are designed to handle connectivity, processing, and data analytics for applications in smart homes, industrial automation, and smart city infrastructure. The growth of artificial intelligence (AI) and machine learning (ML) is also fueling the need for specialized chips, with companies like Broadcom and Qualcomm developing custom processors for AI computations. In the automotive sector, the shift toward electric and autonomous vehicles is increasing the demand for ASICs to support advanced driver-assistance systems (ADAS), electric powertrains, vehicle-to-everything (V2X) communication, and safety features. Advancements in semiconductor manufacturing, such as 3nm and 5nm process nodes, are enabling the production of smaller, more powerful, and energy-efficient custom SoCs for various industries.
The consumer electronics sector is a key driver, with rising smartphone adoption and increasing disposable incomes boosting demand. Manufacturers like Samsung and Apple are expanding production in countries like India to meet this growth. Generative AI is impacting the market by improving design efficiency and reducing complexity, benefiting industries such as telecommunications, automotive, healthcare, and IoT by shortening time to market and enhancing chip performance.
However, high design and manufacturing costs pose a challenge, with significant initial investments and complex integration requirements limiting market growth.
The market is highly competitive, with major players including Qualcomm, Broadcom, Apple, Intel, Nvidia, TSMC, and Samsung investing in research and development for custom chip design. Strategies such as collaborations, mergers, and acquisitions are common. For example, in 2023, Apple and Broadcom partnered to develop custom SoC chips for AI applications, combining Broadcom’s wireless technology expertise with Apple’s custom silicon design capabilities. Smaller companies like Sondrel, MediaTek, Greenwaves Technologies, and SiFive are also active, focusing on niche and emerging applications. In 2023, MediaTek invested in AI-enhanced SoCs for smart homes, wearables, and automotive applications, offering customizable solutions for mid-range and budget devices in developing economies.
Meticulous Research: AI in smart appliances market is projected to reach $13.08 billion by 2035, up from an estimated $0.96 billion in 2025, growing at a CAGR of 29.8% during the forecast period.
Verified Market Research: The Global Ultra-Low-Power Microcontroller Market Size is projected to grow at a CAGR of 8.92% from 2024 to 2031. The market was valued at USD 4.57 Billion in 2024 and is expected to reach USD 9.06 Billion by the end of the forecast period.
Valuates Reports finds The Temporary Wafer Bonding Materials Market was estimated to be worth USD 269.58 Million in 2024 and is forecast to a readjusted size of USD 400.17 Million by 2031 with a CAGR of 5.56% during the forecast period 2025-2031.
