Applied Materials announced a strategic investment in BE Semiconductor Industries. Applied Materials has purchased 9 percent of the outstanding shares of Besi’s common stock, building upon four years of successful collaboration on hybrid bonding technology for advanced packaging.
Since 2020, Applied Materials and Besi have been co-developing the industry’s first fully integrated equipment solution for die-based hybrid bonding. This technology is critical for the advanced packaging of semiconductors, enabling designers and manufacturers to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, increasing density and shortening the lengths of interconnect wiring between chiplets, resulting in improved performance, power consumption, and cost.
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“We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co-developing the industry’s most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI,” said Terry Lee, Corporate Vice President and General Manager, Heterogeneous Integration and Packaging at Applied Materials. “We look forward to furthering our collaboration with Besi and delivering innovative technology to our customers.”
The integrated hybrid bonding system co-developed by Applied Materials and Besi combines Applied’s expertise in front-end wafer and chip processing with Besi’s leading die placement, interconnect, and assembly solutions. This system is designed to meet the high-volume manufacturing needs of chipmakers over the next several years.
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Learn more at www.appliedmaterials.com.
