izmomicro, a Bengaluru, India based custom SiP & IC Packaging company for high-density, high-performance systems is partnering with IIT Madras in developing packaging solutions for photonic IC chips developed by Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS), Center of Excellence (CoE), led by Prof. Bijoy Das. izmo Microsystems said it is leveraging its expertise in System-in-Package (SiP) solutions to provide a state-of-the-art packaging solution for the photonic chip, covering design, fabrication, and testing. Aligning with India’s growing focus on semiconductor and photonics innovation, this joint effort is aimed at positioning India at the forefront of next generation computing technologies.
Established in year 2021, the CoE-CPPICS received a seed funding of Rs. 2,665 Lakhs from the MeitY, Govt. of India and in-kind contribution of Rs. 325 Lakhs from the izmo Microsystems. The important driver of this funding is due to 14 years of R&D work by the Integrated Optoelectronic Research Group led by Prof. Bijoy Krishna Das in the area of silicon photonics technology.
The partnership focuses on the design, development, and advanced packaging of programmable photonic processor core using Silicon Photonics Technology, a pioneering step in the evolution of photonic computing and communication. The immediate aim of the centre is to provide better solutions for microwave and quantum photonics applications.
Silicon photonics is transforming industries by boosting data speeds, cutting power use, and shrinking optical components. It enhances high-speed data centers and telecom with better optical interconnects, speeds up AI and machine learning through optical computing, supports quantum computing for secure communication, and improves biomedical imaging and sensing for precise healthcare diagnostics.
Prof. Bijoy Krishna Das mentioned "izmo Microsystems has been a key partner in advancing photonic chip packaging for CPPICS R&D program at IIT Madras. Their expertise in System-in-Package (SiP) solutions has played a vital role in scaling our chip-scale microwave and quantum photonics applications. As the CPPICS team develop large-scale multipurpose programmable photonic processor, we are jointly committed to innovate energy-efficient system-in-package solutions for ever increasing silicon photonics market”
"We are honored to collaborate with IIT Madras on this ambitious project," said Dinanath Soni, Head of izmo Microsystems Division of izmo Ltd. "The development of the programmable photonic chip marks a significant leap in photonic integration, and izmo Microsystems is committed to providing cutting-edge SiP packaging solutions to ensure its success. This partnership underscores our dedication to driving silicon photonics and semiconductor advancements, enabling high-performance, scalable solutions for future applications. I"
