News

Cyient Semiconductors Signs Agreement for Majority Stake in Kinetic Technologies Amid Edge AI and Power IC Demand
Cyient Semiconductors has signed a definitive agreement to acquire a majority stake in Kinetic Technologies, a company specializing in power management and high-performance analog and mixed-signal integrated circuits, for a total consideration of up to USD 93 million. The deal creates a co
3 min read
2025 Turned Breakthrough Year for Humanoid Robots Amid the Safety Concern
In 2025, artificial intelligence achieved rapid global advancements, with embodied AI propelling humanoid robotics from prototypes to industrial pilots and early commercial deployments. Leading companies worldwide including Tesla with Optimus, Figure AI with Figure 02/03, Boston Dynamics &n
5 min read
VLSI Chip Design and Tape-out: IHP Advances Open-Source Chip Fabrication with 2026 MPW Runs and Upcoming PDK Release
Germany based Leibniz Institute for High Performance Microelectronics (IHP) continues to democratize access to cutting-edge silicon fabrication through its open-silicon Multi-Project Wafer (MPW) program, with several affordable runs scheduled for 2026. This program targets academics, start
3 min read
AI Data Centers Drive 2026 DRAM Memory Chip Shortage, Impacting Smartphone and PC Markets
In late 2025, a global shortage of DRAM memory chips emerged due to demand from AI data centers outstripping supply. Major manufacturers Samsung Electronics, SK Hynix, and Micron Technology shifted production capacity toward high-bandwidth memory (HBM) and high-capacity DDR5 for AI servers, reduc
4 min read
Mixx Technologies Appoints Former Broadcom Executive BC Ooi to Board Amid Co-Packaged Optics Push for AI Infrastructure
Mixx Technologies, a company focused on silicon-integrated optical connectivity for AI infrastructure, announced on December 10, 2025, the appointment of Boon Chye (BC) Ooi to its Board of Directors. Ooi, a semiconductor executive with over 30 years of experience, previously served as Senior Vice
3 min read
Mini-Circuits Opens Bangalore Office for RF and Microwave Sales and Engineering Support Amid MAPCON 2025
Mini-Circuits announced the opening of its new sales and applications engineering office in Bangalore as part of its strategy to expand presence in India and support customers in the RF and microwave technology market. The new office provides responsive service, hands-on engineering collab
2 min read
AI ASIC and HPC Trends Drive Pure-Play Design Services Market in 2025-2026
By the end 2025, the pure-play ASIC and SoC VLSI semiconductor chip design services market has entered a transitional phase following the AI-fueled surge in 2024. Providers focus on turnkey customer-specific solutions, with demand tied to artificial intelligence (AI), high-performance computing (
5 min read
From the Early Pentium to the Cutting Edge PC CPU in 2025: A 32-Year Leap in CPU Performance
The original Intel Pentium processor, launched in March 1993, marked the dawn of a new era in personal computing with its superscalar design, running at 60–66 MHz. Fast-forward to late 2025, and the flagship consumer PC CPUs include AMD's Ryzen 9000 series (Zen 5 architecture) semiconductor
5 min read
History of Semiconductor Fab Plants in China from 60s to 2025: Few Micron node Low volume to 5 nm mega Foundries
China's semiconductor fabrication industry has evolved from modest, state-driven beginnings in the mid-20th century to a major global force by 2025. Massive state investments, foreign partnerships, and a drive for self-reliance have fueled this growth, with research institutions under the Chinese
6 min read
AI Boom Propels Semiconductor Memory Market to Record $200 Billion in 2025, Led by Explosive HBM-Driven DRAM Growth
The global semiconductor memory market has shattered records in 2025, may go above $200 billion in revenue—a robust estimated 18% increase from around $180 billion in 2024 as per our latest analysis by EMITT Solutions. This surge marks two consecutive years of unprecedented highs, fueled pr
5 min read
Building an OSAT Business in the Semiconductor Packaging Market: Trends and Options for 2026
The semiconductor industry is undergoing a profound transformation, with packaging emerging as a critical differentiator in performance, power efficiency, and cost. As front-end fabrication approaches physical limits, Outsourced Semiconductor Assembly and Test (OSAT) providers a
10 min read
Tamil Nadu TIDCO Issues RFP for Semiconductor Design and Testing CoE Amid Power Electronics Growth
Tamil Nadu Industrial Development Corporation Ltd (TIDCO) has issued Notice dated 24.12.2025 and a Request for Proposal (RFP) to establish a Centre of Excellence (CoE) for semiconductor design and testing infrastructure development in Tamil Nadu. The RFP invites proposals from entiti
3 min read
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