Texas Instruments announced new isolated power modules designed to increase power density, efficiency, and safety in applications including data centers and electric vehicles (EVs). The UCC34141-Q1 and UCC33420 modules use TI’s proprietary IsoShield technology.
IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, reducing solution size by as much as 70%. The new devices join TI’s portfolio of over 350 power modules with optimized packages. They help engineers maximize power density while reducing material costs and design time in power applications.
The modules pack more power into smaller spaces while reducing area, cost, and weight. TI is showcasing the innovations at the 2026 Applied Power Electronics Conference (APEC) in San Antonio, Texas, from March 23-26.
Kannan Soundarapandian, vice president and general manager of High Voltage Products at TI, stated that packaging innovation is transforming the power industry with power modules leading the change. He noted that IsoShield technology provides smaller solutions with improved efficiency and reliability and faster time to market, reflecting TI’s commitment to advancing power semiconductor technology.
The UCC34141-Q1 and UCC33420 isolated power modules leverage multichip packaging to achieve higher power density in isolated power designs.
