Memory
Micron Breaks Ground on $100 Billion New York Megafab in Clay, Onondaga County
Micron Technology officially broke ground today on its planned $100 billion leading-edge memory manufacturing complex in Onondaga County, New York. The project, located in the town of Clay, is expected to become the largest semiconductor manufacturing facility in the United States upon completion
4 min read
Micron Signs $1.8 Billion LOI to Acquire PSMC's Tongluo P5 Fab Amid Tight DRAM Supply
Micron Technology has signed an exclusive Letter of Intent (LOI) to acquire Powerchip Semiconductor Manufacturing Corporation’s (PSMC) P5 fabrication site in Tongluo, Miaoli County, Taiwan, for a total cash consideration of US$1.8 billion. The deal includes an existing 300mm fab clea
4 min read
SK Hynix Unveils 16-Layer HBM4 and AI Memory Solutions at CES 2026
SK hynix is operating a customer exhibition booth at the Venetian Expo during CES 2026, held from January 6 to 9 local time, to display its next-generation AI memory solutions under the theme "Innovative AI, Sustainable tomorrow." The company is focusing on the customer booth this year, af
3 min read
AI Data Centers Drive 2026 DRAM Memory Chip Shortage, Impacting Smartphone and PC Markets
In late 2025, a global shortage of DRAM memory chips emerged due to demand from AI data centers outstripping supply. Major manufacturers Samsung Electronics, SK Hynix, and Micron Technology shifted production capacity toward high-bandwidth memory (HBM) and high-capacity DDR5 for AI servers, reduc
4 min read
AI Boom Propels Semiconductor Memory Market to Record $200 Billion in 2025, Led by Explosive HBM-Driven DRAM Growth
The global semiconductor memory market has shattered records in 2025, may go above $200 billion in revenue—a robust estimated 18% increase from around $180 billion in 2024 as per our latest analysis by EMITT Solutions. This surge marks two consecutive years of unprecedented highs, fueled pr
5 min read
Semiconductor IP for Advanced 2nm SoCs in the Silicon AI Era: Winners, Money-Spinning IPs, and Rising Trends
As we enter late 2025, the semiconductor industry is entering 2nm era enabling further growth of chips used in artificial intelligence (AI) systems and also for various other applications such as smart phone SoC and personal computer
6 min read
Global DRAM Revenue Surges 30.9% in Q3 2025 as Micron Gains Market Share
Global DRAM industry revenue reached $41.4 billion in the third quarter of 2025, up 30.9% from the previous quarter, according to TrendForce research. The increase stemmed from rises in conventional DRAM contract prices, higher bit shipments, and expanded high-bandwidth memory (HBM) volumes.
3 min read
Littelfuse CPC1601M Load-Powered 60V 2A Latching Solid-State Relay Enables Battery-Less Smart Thermostats and HVAC Controls
Littelfuse has released the CPC1601M, a 60 V, 2 A normally open (1-Form-A) solid-state latching relay in a 3 × 3 mm DFN package. The CPC1601M operates in load-powered harvest mode using o
1 min read
AI Surveillance HDD: Toshiba S300 AI Series Launches with 8-24 TB Capacities and 550 TB Annual Workload
Toshiba Electronic Devices & Storage Corporation introduced the S300 AI surveillance hard disk drives for AI-driven video applications. The S300 AI series offers capacities from 8 TB to 24 TB. It supports large-scale continuous recording and retention for AI video analytics servers and
2 min read
SK hynix Unveils AI-NAND AIN Family for AI Inference at OCP 2025 Summit
SK hynix presented its next-generation NAND storage product strategy at the 2025 OCP (Open Compute Project) Global Summit, held in San Jose, California, from October 13 to 16. The company addressed the rapid growth of the AI inference market, where demand for NAND storage products to proces
4 min read
Toshiba Verifies 12-Disk Stacking for HDDs Amid AI Data Growth, Targets 40TB Models in 2027
Toshiba Electronic Devices & Storage Corporation has become the first in the storage industry to verify 12-disk stacking technology for hard disk drives, based on company research as of October 14, 2025. This development integrates with Microwave-Assisted Magnetic Recording (MAMR) technology
2 min read
JEDEC Advances UFS 5.0 Standard for AI, Mobile, and Edge Flash Storage
JEDEC Solid State Technology Association announced that the Universal Flash Storage (UFS) 5.0 standard is nearing completion. Designed for mobile, computing, automotive, edge computing, and gaming console applications, UFS 5.0 aims to deliver faster data access and improved performance over
2 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
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