TDK Corporation announced the FS3303, the first device in an expanded micro POL family of ultra-compact, non-isolated DC-DC power modules. The FS3303 measures 2.5 × 2.5 mm with a height of 1.2 mm and delivers 3 A output current. It achieves efficiency up to 95% and supports operation at ambient temperatures up to +90 °C, or up to +125 °C with derating. The module supports input voltages from 2.7 V to 6 V and output voltages from 0.4 V to 3.3 V.
Designed for high-density applications, the FS3303 targets optical modules in AI edge systems, ASICs, SoCs, DSPs, and AI chipsets. It uses TDK’s 3D chip-embedded packaging technology that integrates the controller, driver, MOSFETs, and inductor, minimizing external components.
The FS3303-0400-AL variant is now in full production and available for sampling at major distributors. The broader portfolio will cover output currents from 3 A to 80 A with height profiles between 1.2 mm and 1.7 mm.
