CADFEM APAC and SilTerra Malaysia Sdn. Bhd. have signed a Memorandum of Understanding (MoU) to establish a framework for advancing semiconductor technologies through simulation-led engineering and closer design-process integration.
The partnership combines CADFEM APAC’s capabilities in multiphysics simulation and digital engineering with SilTerra’s semiconductor manufacturing, process development, and fabrication expertise. The collaboration targets faster development cycles, improved design validation, and better alignment between simulation models and manufactured devices.
Central elements include the development of Design-Technology Co-Optimization (DTCO) and System-Technology Co-Optimization (STCO) frameworks. These will integrate device, process, and design domains to support earlier technology exploration and validation. CADFEM APAC will contribute modeling of device physics, material behavior, thermal-electrical interactions, variability, and system-level performance, while SilTerra will supply process insights, fabrication data, and characterization results.
The partners will also examine the use of Agentic AI, natural language processing (NLP), Retrieval-Augmented Generation (RAG), AI-assisted EDA tools, and PDK integrations to improve semiconductor development workflows. This includes support for optical circuit concepts, manufacturable SoCs, and Photonic Integrated Circuits (PICs). SilTerra is advancing next-generation optical interconnect technologies on unified silicon architectures to address data transfer and power dissipation requirements.
Additional areas of cooperation cover reliability engineering for automotive and industrial applications, focusing on thermal, electrical, and environmental effects, along with a continuous feedback loop between simulation and fabrication for improved model correlation.
Beng Joo Thung, Senior Vice President at SilTerra Malaysia Sdn. Bhd., stated: “The future of semiconductor advancement will be defined by how effectively organizations can connect design, process development, and manufacturing within a unified engineering framework.”
Dr.-Ing. Madhukar Chatiri, CEO of CADFEM APAC, said: “By bringing together predictive engineering, simulation expertise, and manufacturing knowledge, this collaboration creates a stronger foundation for faster development, better design decisions, and reduced technology risk.”
The MoU also includes activities to showcase engineering advancements and support the regional semiconductor ecosystem.
