FlexTech, a SEMI Technology Coalition, has issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $500,000. The program is funded by the Army Research Laboratory (ARL), with ARL funding matched by contributions from selected recipients to cover total project costs.
The RFP targets FHE advances in these specific areas:
- Flexible, Moldable Electronics
- Advanced Bonding Reliability
- Novel Flexible Energy Storage Beyond Conventional Architectures
- 2D Materials
Proposals will be evaluated based on organizations’ capabilities, experiences, and strengths. The evaluation criteria include rationale, budget, collaboration value, dual-use (industry and military) applicability, relevance to the topics and the FHE ecosystem, schedules and milestones, reasonable and stretch deliverables, and overall proposal quality.
Full proposals are due by July 6, 2026. Awardees will be notified after review by the RFP committee, which consists of FlexTech Council members and other subject matter experts.
An informational webinar was held on May 20, 2026, at 10:00 a.m. PDT to review the RFP topics and the submission and review process. A recording will be available for those unable to attend.
