Mountain View, California-based Diamond Quanta announced Adamantine Thermal, an engineered-diamond thermal platform intended for integration into advanced packaging workflows and heterogeneous semiconductor systems. The announcement follows the company's participation at CES 2026 in Eureka Park.
At CES 2026, Diamond Quanta demonstrated 300 mm diamond-on-silicon wafer technology compatible with wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding processes. The company also introduced its first commercial diamond glass product, Adamantine Optics™, and held discussions with system OEMs, semiconductor manufacturers, and ecosystem partners regarding potential applications of diamond in advanced packaging.
Adamantine Thermal utilizes the same engineered-diamond manufacturing method shown at CES. Diamond offers high intrinsic thermal conductivity, but integration into semiconductor packaging has previously faced challenges related to surface roughness, bonding compatibility, and large-scale manufacturability.
The company's approach incorporates:
- CMOS-compatible, low-temperature diamond growth on standard substrates
- Laser-based densification to create smooth, bond-ready diamond surfaces
- Support for W2W and C2W bonding workflows suitable for advanced packaging stacks
Adam Khan, Founder and CEO of Diamond Quanta, stated: “Thermal is the most immediate and universal entry point for diamond in electronics. Once diamond can be bonded reliably and at scale, it stops being a research material and becomes a practical platform.”
The platform targets applications including engineered-diamond glass interposers, combining diamond with glass cores increasingly used in advanced packaging for signal integrity and dimensional stability. Adding diamond is intended to provide uniform thermal management, along with improved flatness and mechanical robustness.
Adamantine Thermal is designed to align with standard fab infrastructure and panel-scale workflows, supporting compatibility with W2W and C2W bonding methods used in next-generation interposers and stacked systems.
Diamond Quanta stated that Adamantine Thermal is now entering partner evaluation programs, with engineered-diamond interposer concepts progressing in line with industry timelines for advanced packaging adoption. The thermal platform complements the earlier Adamantine Optics offering and forms part of a broader roadmap covering thermal management, photonics, interposers, and future diamond-enabled systems.
Diamond Quanta develops an engineered-diamond platform for integration into existing semiconductor manufacturing workflows.
