Siemens Digital Industries Software has partnered with United Microelectronics Corporation (UMC), a leading global semiconductor foundry, to implement Siemens' mPower software for electromigration (EM) and IR drop analysis. The collaboration enables chip designers to optimize performance and improve reliability.
The mPower software offers scalability, allowing UMC to perform accurate analysis on large layouts. Its Transistor-Level Pre-Layout EM and IR Drop capabilities facilitate early detection of potential issues, enabling designers to address them early in the development process. UMC conducted extensive evaluations and successfully utilized mPower’s automated processes for comprehensive SRAM full-chip circuit analysis, providing precise IR drop distribution assessments and early-stage risk detection.
Osbert Cheng, vice president of device technology development & design support at UMC, stated that integrating mPower into their design verification flow enhances their ability to identify and resolve issues earlier, aligning with modern design requirements and ensuring product quality for customers.
The implementation of mPower at UMC provides several benefits, including accelerated time-to-market through scalable and rapid verification, improved product reliability via early issue detection, and seamless integration with existing design workflows for comprehensive power analysis.
Ankur Gupta, senior vice president and general manager of Digital Design Creation Platform at Siemens Digital Industries Software, noted that the collaboration marks a significant advancement in semiconductor design verification capabilities, addressing the industry’s growing complexity challenges.
