SEMICON Taiwan 2025, scheduled for September 10–12 at Taipei Nangang Exhibition Center, will focus on advanced packaging technologies, including 3DIC, fan-out panel-level packaging (FOPLP), chiplets, and co-packaged optics (CPO), driven by increasing demand for AI and high-performance computing (HPC). Global forums will commence on September 8, addressing industry trends and challenges.
Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI, stated that advanced manufacturing capacity is projected to reach 1.4 million wafers per month by 2028 due to AI demand. Technologies like 3DIC and FOPLP are critical for system-level integration as single-chip scaling faces limitations. The event aims to facilitate collaboration across the semiconductor industry’s evolving supply chain.
SEMI will launch the 3DIC Advanced Manufacturing Alliance (3DICAMA) at the event to foster cross-industry collaboration, strengthen supply chain resilience, promote standards adoption, and accelerate technology commercialization. The alliance reflects the industry’s shift toward system-level solutions, with Taiwan positioned as a key hub for advanced packaging innovation amid global supply chain restructuring.
The event will feature the Heterogeneous Integration Global Summit (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit, covering topics such as design, materials, processes, and supply chains. Representatives from ASE, Broadcom, Lightmatter, MediaTek, Nvidia, Sony, and TSMC will discuss challenges in 3DIC, CPO, and AI packaging, while AMD and PTI will present at the FOPLP Innovation Forum.
The Heterogeneous Integration Area will include three pavilions—3DIC Advanced Packaging, FOPLP, and Semiconductor Packaging—showcasing technologies, demonstrations, standards, and supply chain collaboration. Companies such as Innolux, PTI, Comet, Coherent, E&R Engineering, GP, Lam Research, Manz, Mirle, PDF Solutions, PSK, Shibaura, and Utechzone will participate.
Registration for SEMICON Taiwan 2025 is open, with free visitor codes available until August 31 and a 30% discount on the International Semiconductor Forum for early bird registrants. More information is available on the official website.
